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Volumn 42, Issue 9-10, 2009, Pages 831-841

Process chains for the manufacturing of molded interconnect devices

Author keywords

Molded interconnect devices; Process chains; Selective metallization of polymers

Indexed keywords

CHAINS; EXPERIMENTS; INDUSTRIAL APPLICATIONS; MANUFACTURE; METALLIZING; PLASTIC PARTS; POLYMERS;

EID: 78049463680     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-008-1660-9     Document Type: Article
Times cited : (65)

References (7)
  • 3
    • 79551691783 scopus 로고    scopus 로고
    • Manufacturing of molded interconnect devices from prototyping to mass production with laser direct structuring
    • Heininger N, Wolfgang J, Jürgen H (2004) Manufacturing of molded interconnect devices from prototyping to mass production with laser direct structuring. In: International Congress MID 2004
    • (2004) International Congress MID 2004
    • Heininger, N.1    Wolfgang, J.2    Jürgen, H.3
  • 5
    • 77958027520 scopus 로고    scopus 로고
    • Two component micro injection moulding for moulded interconnect devices
    • Ph.D. thesis, February, ISBN no- 978-87-89502-75-5
    • Islam A (2008) Two component micro injection moulding for moulded interconnect devices. Ph.D. thesis, Department of Mechanical Engineering, Technical University of Denmark, February, ISBN no- 978-87-89502-75-5
    • (2008) Department of Mechanical Engineering, Technical University of Denmark
    • Islam, A.1
  • 6
    • 84897912425 scopus 로고    scopus 로고
    • Moulded interconnect devices by two shot moulding and laser induced selective activation
    • Master's thesis, Technical University of Denmark, December
    • Sun J (2007) Moulded interconnect devices by two shot moulding and laser induced selective activation. Master's thesis, Department of Manufacturing Engineering and Management, Technical University of Denmark, December
    • (2007) Department of Manufacturing Engineering and Management
    • Sun, J.1
  • 7
    • 84897917427 scopus 로고
    • Sensitizing nonconductive substrates prior to electroless plating
    • GB Patent 2 154 251 A
    • Arcilesi DA, Klein RK, Magda D (1985) Sensitizing nonconductive substrates prior to electroless plating. GB Patent 2 154 251 A
    • (1985)
    • Arcilesi, D.A.1    Klein, R.K.2    Magda, D.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.