Selected process chains for manufacturing of moulded interconnect devices (MID)

Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007

Volumn 1, Issue , 2007, Pages 176-179

  Hansen, H N ^a   Tang, P T ^b   Islam, A ^a   Tosello, G ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b IPU Denmark   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

INTERCONNECT DEVICES; PROCESS CHAIN;

EID: 84908245718     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. G. Naundorf & H. Wissbrock, "Conductor Track Structures and Method for Production Thereof", US patent application 2004/0241422 A1
2. A. Islam, Hansen H.N., Tang P.T., Kjaer E.M., Bond strength of two-component injection moulded MIDs, Proc. 7th international conference on Moulded Interconnect Devices, September 2006, p.245-254.
3. Tosello G., Hansen H.N., Tang P.T., Investigation of over-moulded hybrid metal/polymer devices, Proc. 7th international conference on Moulded Interconnect Devices, September 2006, p.279-292.
4. Tosello G., Hansen H.N., In-process assembly and testing of micro metal inserts in a polymer matrix, Proc. 2nd International Conference on Multi Material Micro Manufacture, Grenoble, France, September 2006, p.83-86.