Two-component microinjection moulding for MID fabrication

Plastics, Rubber and Composites

Volumn 39, Issue 7, 2010, Pages 300-307

  Islam, A ^a,b   Hansen, H N ^a   Tang, P T ^c   Jorgensen M B ^b   Orts S F ^b  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b Sonion A/S   (Denmark)

^c IPU Denmark   (Denmark)

Author keywords

Moulded interconnect devices; Selective metallisation; Two component injection moulding

Indexed keywords

AUTOMOTIVE SECTOR; COST EFFECTIVE; DIFFERENT PROCESS; ELECTRICAL INFRASTRUCTURE; INJECTION MOULDING; INTERCONNECT DEVICES; MASS PRODUCTION; METALLISATION; MICROINJECTION MOULDING; MINIATURISATION; PLASTIC SUBSTRATES; TWO-COMPONENT;

MANUFACTURE;

INJECTION MOLDING;

EID: 78049455350     PISSN: 14658011     EISSN: 17432898     Source Type: Journal    
DOI: 10.1179/174328910X12691245470356     Document Type: Conference Paper

References (5)

1. A. Islam: 'Two component micro injection moulding for moulded interconnect devices', PhD thesis, Department of Mechanical Engineering, Technical University of Denmark, Kongens Lyngby, Denmark, 2008.
2. K. Feldmann, C. Goth, J. Heyer and W. John: Proc. 8th Int. Congr. on 'Moulded interconnect devices' Nuremberg-Fueth, Germany, September 2008, Research Association Moulded Interconnect Devices 3-D MID e.V.
3. A. Islam, H. N. Hansen, P. T. Tang and J. Sun: 'Process chains for the manufacturing of moulded interconnect devices', Int. J. Adv. Manuf. Technol., 2009, 42, 831-841.
4. A. Islam, H. N. Hansen and P. T. Tang: 'Micro-MID manufacturing by two-shot injection moulding', Eur. Mag. OnBoard Technol., 2008, 9, (2), 10-13.
5. D. A. Arcilesi, R. K. Klein and D. Magda: 'Sensitizing nonconductive substrates prior to electroless plating', GB patent no.2 154 251 A, 1985.