Copper nanofluids: Synthesis and thermal conductivity

Current Nanoscience

Volumn 6, Issue 5, 2010, Pages 512-519

  Jiang, Wei ^a   Wang, Liqiu ^a  

^a UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Chemical stability; Colloidal stability; Copper nanofluids; One step chemical reduction; Thermal conductivity

Indexed keywords

CHEMICAL STABILITY; COPPER; NANOFLUIDICS; NANOPARTICLES; PARTICLE SIZE; PARTICLE SIZE ANALYSIS; THERMAL CONDUCTIVITY OF LIQUIDS; THERMAL CONDUCTIVITY OF SOLIDS;

CHEMICAL AND COLLOIDAL STABILITIES; CHEMICAL REDUCTION; CHEMICAL REDUCTION METHODS; COLLOIDAL STABILITY; INTERFACIAL THERMAL RESISTANCE; NANOFLUIDS; SURFACTANT CONCENTRATIONS; TRANSIENT HOT WIRE METHOD;

THERMAL CONDUCTIVITY;

CITRIC ACID; COPPER; NANOPARTICLE; SURFACTANT;

ARTICLE; ELECTROCHEMICAL ANALYSIS; HEAT TOLERANCE; NANOFABRICATION; NANOFLUIDICS; PARTICLE SIZE; PH; PRIORITY JOURNAL; THERMAL CONDUCTIVITY;

EID: 77958504778     PISSN: 15734137     EISSN: None     Source Type: Journal    
DOI: 10.2174/157341310797574989     Document Type: Article

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