Evaluation of adhesion materials for gold line-and-space surface plasmon antenna on SOI-MOS photodiode

2010 Silicon Nanoelectronics Workshop, SNW 2010

Volumn , Issue , 2010, Pages

  Satoh, Hiroaki ^a   Matsuo, Yuki ^a   Inokawa, Hiroshi ^a   Ono, Atsushi ^a  

^a SHIZUOKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION LAYER; ELECTROMAGNETIC SIMULATION; GOLD LINES; LINE-AND-SPACE; METAL-INSULATOR-SEMICONDUCTORS; POLARIZED LIGHT; REJECTION RATIOS; SILICON-ON-INSULATORS; SURFACE PLASMON ANTENNA; SURFACE PLASMONS;

ADHESION; ANTENNAS; METAL INSULATOR BOUNDARIES; MIS DEVICES; NANOELECTRONICS; PHOTODIODES; PLASMONS; SEMICONDUCTING SILICON COMPOUNDS; SILICON NITRIDE;

SEMICONDUCTING SILICON;

EID: 77958015140     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SNW.2010.5562555     Document Type: Conference Paper

References (4)

1. T. Ishi, et al., Jpn. J. Appl. Phys., vol.44, no.12, pp.L364-L366, 2005.
2. H. Satoh and H. Inokawa, IEEE Silicon Nanoelectronics Workshop, M0230, 2008.
3. H. Satoh and H. Inokawa, IEEE Silicon Nanoelectronics Workshop, pp.117-118, 2009.
4. L. Aballe. et al., Appl. Phys. Lett., vol.84, no.24, pp.5031-5033, 2004.