Encapsulated MEMS resonators- A technology path for MEMS into frequency control applications

2010 IEEE International Frequency Control Symposium, FCS 2010

Volumn , Issue , 2010, Pages 1-4

  Kim, B ^a   Melamud, R ^a   Candler, R A ^a   Hopcroft, M A ^a   Jha, C M ^a   Chandorkar, S ^a   Kenny, T W ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMMERCIAL APPLICATIONS; FREQUENCY CONTROL; HIGH QUALITY; LONG TERM STABILITY; LOW-COST PACKAGING; MEMS RESONATORS; QUARTZ CRYSTAL;

PACKAGING; QUARTZ; RESONATORS;

MICROELECTROMECHANICAL DEVICES;

EID: 77957865913     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/FREQ.2010.5556386     Document Type: Conference Paper

References (7)

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2. R.N. Candler, W.T. Park, H.M. Li, G. Yama, A. Partridge, M. Lutz, and T.W. Kenny, "Single Wafer Encapsulation of MEMS Devices", IEEE Transactions on Advanced packaging 26, 227 (2003).
3. B.S. Berry and W.C. Pritchet, "Temperature Compensation for Constant-Frequency Electromechanical Oscillators", IBM Technical Disclosure Bulletin, Vol. 14, #4, P. 1237-8 (1971).
4. B. Kim, R.N. Candler, M.A. Hopcroft; M. Agarwal, WT Park, T.W. Kenny, "Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators" Sensors and Actuators A (Physical), 136, 125 (2007).
5. R. Melamud, S.A. Chandorkar, B. Kim, HK Lee, J. Salvia, G. Bahl, MA Hopcroft, and TW Kenny, "Temperature-Insensitive Composite Micromechanical Resonators", IEEE JMEMS 18, 1409 (2009).
6. S. Schodowski, "Resonator Self-Temperature-Sensing Using a Dual-Harmonic-Mode Crystal Oscillator," Proc. 43rd Annual Symposium on Frequency Control, pp. 2-7, 1989, IEEE Catalog No. 89CH2690-6.
7. J.C. Salvia, R. Melamud, S.A. Chandorkar, S.F. Lord and T.W. Kenny, "Real-Time Temperature Compensation of MEMS Oscillators using an Integrated Micro-Oven and a Phase-Locked Loop", IEEE JMEMS 19, 192 (2010).