Thermal cycling induced load on copper-ribbons in crystalline photovoltaic modules

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7773, Issue , 2010, Pages

  Meier, R ^a   Kraemer, F ^a   Wiese, S ^a   Wolter, K J ^b   Bagdahn, J ^a  

^a FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

FEM; Reliability; Ribbon; Thermal cycling test; Thermo mechanical

Indexed keywords

A-THERMAL; DIGITAL IMAGE CORRELATIONS; FATIGUE BEHAVIOR; FEM; FINITE ELEMENT ANALYSIS; INDIVIDUAL CELLS; INTERCONNECTORS; LAYOUT OPTIMIZATION; MEASURING CELLS; PHOTOVOLTAIC MODULES; RIBBON; SOLAR MODULE; THERMAL CYCLING TEST; THERMO-MECHANICAL; THERMO-MECHANICAL STRESS;

COPPER; FINITE ELEMENT METHOD; IMAGE ANALYSIS; PHOTOELECTROCHEMICAL CELLS; PHOTOVOLTAIC CELLS; RELIABILITY; THERMAL CYCLING;

STRESSES;

EID: 77957826117     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.861350     Document Type: Conference Paper

References (4)

1. th IEEE PVSC, June 20-25, 2010, Honolulu, USA
2. Wiese, S. et al, "Constitutive Behaviour of Copper-Ribbons used in Solar Cell Assembly Processes", Proc. EuroSimE 2009, April 28-30, 2009, Delft, The Netherlands, pp.44-51
3. Meier, R. et al, "Thermo-mechanical Behaviour of Copper Ribbon Materials", Proc. 24th EU PVSEC 2009, Sept. 21-25, 2009, Hamburg, Germany, pp. 3413-3419
4. Wiese, S. et al, "Interconnection Technologies for Photovoltaic Modules - Analysis of technological and mechanical Problems" Proc. EuroSimE 2010, April 26-28, 2010, Bordeaux, France, pp. 345-350