Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2010, Pages 1283-1288

  Meier, R ^a   Kraemer, F ^a   Wiese, S ^a   Wolter, K J ^b   Bagdahn, J ^a  

^a FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CELLS; FATIGUE BEHAVIOUR; INDUCED STRAIN; INDUSTRIAL PROCESSS; INTERCONNECTORS; LIFETIME MODELS; LIMITING FACTORS; LOADING CONDITION; MECHANICAL FATIGUE TESTING; PHOTOVOLTAIC MODULES; QUANTITATIVE ESTIMATION; SOLAR MODULE; TEMPERATURE CHANGES; THERMAL CYCLING TEST; THERMO-MECHANICAL; THERMO-MECHANICAL LOADING;

FATIGUE TESTING; PHOTOVOLTAIC EFFECTS; SOLAR CELLS;

STRESSES;

EID: 78650106658     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2010.5614220     Document Type: Conference Paper

References (4)

1. Meier, R. et al, "Thermomechanical Loading on Copper Ribbons in Photovoltaic Modules", Proc. SPIE Optics and Photonics, August 1-5, 2010, San Diego, USA.
2. Wiese, S. et al, "Constitutive Behaviour of Copper Ribbons used in Solar Cell Assembly Processes", Proc. EuroSimE 2009, April 28-30, 2009, Delft, The Netherlands, pp. 44-51.
3. Meier, R. et al, "Thermo-mechanical Behaviour of Copper Ribbon Materials", Proc. 24th EU PVSEC 2009, Sept. 21-25, 2009, Hamburg, Germany, pp. 3413-3419.
4. Wiese, S. et al, "Interconnection Technologies for Photovoltaic Modules - Analysis of technological and mechanical Problems", Proc. EuroSimE 2010, April 26-28, 2010, Bordeaux, France, pp. 345-350.