메뉴 건너뛰기




Volumn , Issue , 2010, Pages 348-351

Highly directive package-integrated dipole arrays for low-cost 60-GHz front end modules

Author keywords

60 GHz; Dipole antenna; Dipole arrays; Directive antennas; Packaging

Indexed keywords

60-GHZ; CHIP EMBEDDED; DESIGN FEATURES; DIPOLE ARRAYS; DIRECTIVITY; FEED NETWORKS; FRONT END MODULES; PEAK GAIN; VIA INTERCONNECTION;

EID: 77957812550     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2010.5517163     Document Type: Conference Paper
Times cited : (14)

References (7)
  • 1
    • 33750211990 scopus 로고    scopus 로고
    • Broadband planar superstrate antenna for integrated millimeter-wave transceivers
    • Oct.
    • T. Zwick, L. Duixian, and B.P. Gaucher, "Broadband planar superstrate antenna for integrated millimeter-wave transceivers," IEEE Trans. Ant. and Prop., vol.54, no.10, pp. 2790-2796, Oct. 2006.
    • (2006) IEEE Trans. Ant. and Prop. , vol.54 , Issue.10 , pp. 2790-2796
    • Zwick, T.1    Duixian, L.2    Gaucher, B.P.3
  • 2
    • 77949829315 scopus 로고    scopus 로고
    • Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios
    • Oct.
    • Y. P. Zhang, et. al, "Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios," IEEE Trans. Ant. and Prop., vo1.57, no.10, pp.2842-2852, Oct. 2009.
    • (2009) IEEE Trans. Ant. and Prop. , vol.57 , Issue.10 , pp. 2842-2852
    • Zhang, Y.P.1
  • 3
    • 39049163859 scopus 로고    scopus 로고
    • High-efficiency 60-GHz antenna fabricated using low-cost silicon micromachining techniques
    • Honolulu, Hawaii, June 10-15
    • N. Hoivick, et. al, "High-efficiency 60-GHz antenna fabricated using low-cost silicon micromachining techniques," in Proc. IEEE Antennas Prop. Soc. Int. Symp., pp. 5043-5046, Honolulu, Hawaii, June 10-15,2007.
    • (2007) Proc. IEEE Antennas Prop. Soc. Int. Symp. , pp. 5043-5046
    • Hoivick, N.1
  • 4
    • 72949098833 scopus 로고    scopus 로고
    • Organic wafer-scale packaging for X-band SiGe low noise amplifier
    • Rome, italy, Oct.
    • C. Patterson, et. al, "Organic wafer-scale packaging for X-band SiGe low noise amplifier," in Proc. IEEE European Microwave Con!, pp. 141-144, Rome, italy, Oct. 2009.
    • (2009) Proc. IEEE European Microwave Conf. , pp. 141-144
    • Patterson, C.1
  • 6
    • 77957812681 scopus 로고    scopus 로고
    • http://www.ansofi.com


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.