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Volumn 30, Issue 8, 2010, Pages 696-705
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Supramolecular polymer for enhancement of adhesion and processability of hot melt polyamides
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Author keywords
Environmentally friendly adhesives; Hot melt adhesives; Mechanical properties of adhesives; Peel test
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Indexed keywords
ADHESION PROPERTIES;
ADHESIVE FORMULATION;
AMOUNT OF ADHESIVE;
CLOUD POINTS;
COMMERCIAL POLYAMIDE;
CRYSTALLISATION;
DUAL ROLE;
ENVIRONMENTALLY FRIENDLY ADHESIVES;
HOT MELT;
MACROSCOPIC PROPERTIES;
MECHANICAL PROPERTIES OF ADHESIVES;
PEEL TESTS;
POLARIZING OPTICAL MICROSCOPY;
POLYAMIDE MATRIX;
PROCESSABILITY;
REINFORCING FILLERS;
RHEOMETRY;
ROOM TEMPERATURE;
SEMICRYSTALLINES;
SUPRAMOLECULAR POLYMERS;
T-PEEL TESTS;
TIME-RESOLVED X-RAY DIFFRACTION;
ADHESION;
AMIDES;
DIFFERENTIAL SCANNING CALORIMETRY;
DYNAMIC ANALYSIS;
DYNAMIC MECHANICAL ANALYSIS;
FATTY ACIDS;
FILLED POLYMERS;
MECHANICAL PROPERTIES;
OPTICAL MICROSCOPY;
PEELING;
PLASTICIZERS;
POLYMER BLENDS;
POLYMERS;
RESINS;
SUPRAMOLECULAR CHEMISTRY;
THERMOPLASTICS;
VEGETABLE OILS;
X RAY DIFFRACTION;
X RAY DIFFRACTION ANALYSIS;
HOT MELT ADHESIVES;
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EID: 77957710729
PISSN: 01437496
EISSN: None
Source Type: Journal
DOI: 10.1016/j.ijadhadh.2010.08.003 Document Type: Article |
Times cited : (28)
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References (18)
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