Mechanical and electrical responses of nanostructured Cu-3 wt%Ag alloy fabricated by ECAP and cold rolling

Journal of Alloys and Compounds

Volumn 504, Issue SUPPL. 1, 2010, Pages

  Ko, Young Gun ^a   Namgung, Seung ^b   Lee, Byung Uk ^b   Shin, Dong Hyuk ^b  

^a Yeungnam University   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

Cu 3 wt Ag alloy; Electrical conductivity; Mechanical properties; Nanostructure

Indexed keywords

AG-ALLOY; ELECTRICAL CONDUCTIVITY; ELECTRICAL RESPONSE; MICROSTRUCTURAL CHANGES; NANOGRAINED STRUCTURE; NANOSTRUCTURED CU; NONEQUILIBRIUM STATE; ROOM TEMPERATURE; TENSION TESTS;

ALLOYS; COLD ROLLING; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; EQUAL CHANNEL ANGULAR PRESSING; GRAIN BOUNDARIES; MECHANICAL PROPERTIES; NANOSTRUCTURES; PRESSING (FORMING); SILVER; TENSILE STRENGTH; TENSILE TESTING;

SILVER ALLOYS;

EID: 77957582331     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.02.198     Document Type: Article

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