Effects of inorganic nanofillers and combinations of them on the complex permittivity of epoxy-based composites

Conference Record of IEEE International Symposium on Electrical Insulation

Volumn , Issue , 2010, Pages

  Kochetov, R ^a   Andritsch, T ^a   Lafont, U ^a   Morshuis, P H F ^a   Smit, J J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Al2O3; AlN; Complex permittivity; Epoxy resin; GPS; SiO2; Surface functionalization

Indexed keywords

AL2O3; ALN; COMPLEX PERMITTIVITY; GPS; SIO2; SURFACE FUNCTIONALIZATION;

ALUMINUM; ALUMINUM NITRIDE; COUPLING AGENTS; DIELECTRIC PROPERTIES OF SOLIDS; EPOXY RESINS; FILLED POLYMERS; FILLERS; NANOPARTICLES; NITRIDES; PERMITTIVITY; RESINS; SILICA; SILICON OXIDES; SURFACE CHEMISTRY; SURFACES; TECHNICAL PRESENTATIONS; TRANSMISSION ELECTRON MICROSCOPY;

DISPERSIONS;

EID: 77957375398     PISSN: 01642006     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ELINSL.2010.5549781     Document Type: Conference Paper

References (5)

1. R. Kochetov, T. Andritsch, U. Lafont, P.H.F. Morshuis, J.J. Smit, "Thermal Conductivity of Nano-filled Epoxy Systems", IEEE Conference on Electrical Insulation and Dielectric Phenomena, Virginia Beach, USA, October 18-21, 2009.
2. E.M. Petrie, "Handbook of Adhesives and Sealants", 2nd edition, McGraw-Hill, New York, 2006.
3. P. Maity, S.V. Kasisomayajula, V. Parameswaran, S. Basu, N. Gupta, "Improvement of Surface Degradation Composites due to Pre-processed Nanometric Alumina Fillers", IEEE Transactions on Dielectrics and Electrical Insulation, vol. 15, ?1, pp. 63-72, 2008. (Pubitemid 351225198)
4. R. Kochetov, T. Andritsch, U. Lafont, P.H.F. Morshuis, J.J. Smit, "The Thermal Conductivity in Epoxy-Aluminum Nitride and Epoxy-Aluminum Oxide Nanocomposite Systems", Nordic Insulation Symposium, Gothenburg, Sweden, June 15-17, pp. 27-30, 2009.
5. T. Tanaka; M. Kozako; N. Fuse; Y. Ohki, "Proposal of a Multi-core Model for Polymer Nanocomposite Dielectrics", IEEE Transactions on Dielectrics and Electrical Insulation, vol. 12 ? 4, pp.669-681, 2005.