Properties of reactive hot melt adhesives modified by polyurethane containing PEG segment intercalated in sodium montmorillonite

International Journal of Material Forming

Volumn 1, Issue SUPPL. 1, 2008, Pages 615-618

  Kim, T K ^a,b   Kim, B K ^a   Kim, Y S ^b   Cho, Ya L ^c   Lee, S Y ^c   Cho, Y B ^d   Kim, J H ^d   Jeong, H M ^d  

^a Pusan National University   (South Korea)

^b Hwaseung T and C Corp   (South Korea)

^c Hosung Chemex Co Ltd   (South Korea)

^d University of Ulsan   (South Korea)

Author keywords

Adhesives; Poly(ethylene glycol); Polyurethanes; Sodium montmorillonite; Viscoelastic properties

Indexed keywords

COMPLEX VISCOSITY; SET TIME; SHEAR RATES; SODIUM MONTMORILLONITE; THERMOPLASTIC POLYURETHANES; VISCOELASTIC PROPERTIES;

BIOLOGICAL MEMBRANES; CLAY MINERALS; COMPLEXATION; ETHYLENE; ETHYLENE GLYCOL; MECHANICAL PROPERTIES; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; POLYURETHANES; SHEAR DEFORMATION; SILICATE MINERALS; SODIUM; THERMOPLASTICS; VISCOELASTICITY;

HOT MELT ADHESIVES;

EID: 77957167486     PISSN: 19606206     EISSN: 19606214     Source Type: Journal    
DOI: 10.1007/s12289-008-0331-6     Document Type: Article

References (15)

1. Malucelli, G., Priola A., Ferrero F., Quaglia A., Frigione M. and Carfagna C., Int J Adhesion Adhesives, 25 (2005) 87.
2. Cui, Y., Hong, L., Wang, X. and Tang, X., J Appl Polym Sci, 89 (2003) 2708.
3. Chambers, J., Moore, T., Huber, L. and Frank, D., Adhesives Age, 41(8) (1998) 24.
4. Hung, J.-M., Hot Melt Symposium, Hilton Head Island, SC, United States, June 10-13 (2001) 91.
5. De Genova R., Harper M. D., Clay W. A., Cranley P. E. and Hunter M. K., Tappi J, 79 (1996) 196.
6. De Genova R.; Grier L., Murray D. P. and Clay W., Tappi J 81 (1998) 196.
7. Atounian, G. N., Hot Melt Symposium, Proceedings, Bal Harbour, FL, United States, June 25-28 (2000) 7.
8. Waites, P. Pigment & Resin Technol, 26 (1997) 300.
9. Pinnavaia, T. J. and Beall G. W., Eds.; Polymer-Clay Nanocomposites, Wiley, New York (2000).
10. Utracki, L. A., Clay-Containing Polymeric Nanocomposites, Rapra Technology, Shawbury (2004).
11. Chun, B. C., Cho. T. K., Chong, M. H., Chung, Y.-C., Chen, J., Martin, D and Cieslinski, R. C., J Appl Polym Sci 106 (2007) 712.
12. Choi, M. Y., Anandhan, S., Youk, J. H., Baik, D. H., Seo, S. W. and Lee. H. S., J Appl Polym Sci., 102 (2006) 3048.
13. Woo, T., Halley, P., Martin, D. and Kim, D. S., J Appl Polym Sci., 102 (2006) 2894.
14. Seo, W. J., Sung, Y. T., Han, S. J., Kim, Y. H., Ryu, O. H., Lee, H. S. and Kim, W. N., J Appl Polym Sci., 101 (2006) 2879.
15. Jeong, H. M., Kim, D. H., Jung, J. S., Kim, T. K., Kim, B. K., Kim, Y. S., Cho, Y. L. and Hwang, J. M. Composite Interface., 14 (2007) 467.