The effect of organoclay on the properties of a reactive hot melt polyurethane adhesive

Composite Interfaces

Volumn 14, Issue 5-6, 2007, Pages 467-476

  Jeong, Han Mo ^a   Kim, Dae Hoon ^a   Jung, Jin Su ^a   Kim, Tae Kyoon ^b   Kim, Byung Kyu ^b   Kim, Yong Sung ^c   Cho, Yang Lae ^d   Hwang, Jeong Mi ^d  

^a University of Ulsan   (South Korea)

^b Pusan National University   (South Korea)

^c Hwaseung T and C Corp   (South Korea)

^d Hosung Chemex Co Ltd   (South Korea)

Author keywords

Bond strength; Organoclay; Polyurethane; Reactive hot melt adhesive; Rheology

Indexed keywords

ADHESIVES; BOND STRENGTH (MATERIALS); RHEOLOGY; SOLIDIFICATION; TRANSMISSION ELECTRON MICROSCOPY; VISCOSITY; X RAY DIFFRACTION;

BONDING INTERACTION; ORGANOCLAY; REACTIVE HOT MELT ADHESIVE;

POLYURETHANES;

EID: 34547535674     PISSN: 09276440     EISSN: 15685543     Source Type: Journal    
DOI: 10.1163/156855407781291227     Document Type: Article

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