Improved dielectric breakdown strength of covalently-bonded interface polymer-particle nanocomposites

Composite Interfaces

Volumn 17, Issue 8, 2010, Pages 719-731

  Schuman, Thomas P ^a   Siddabattuni, Sasidhar ^a   Cox, Olivia ^a   Dogan, Fatih ^b  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^b Architectural and Environmental Engineering   (United States)

Author keywords

Breakdown strength; covalent; cross linking; dielectric properties; glass transition temperature; interfaces; nanocomposite

Indexed keywords

BIFUNCTIONAL; BONDED INTERFACE; BREAKDOWN STRENGTHS; CHARGE FLOW; COVALENT; COVALENT BONDING; CROSS-LINKED INTERFACES; DIELECTRIC BREAKDOWN STRENGTH; DIELECTRIC BREAKDOWNS; DIELECTRIC CONSTANTS; DISPERSANTS; ELECTRICAL RESISTANCES; ENERGY DENSITY; GLASS TRANSITION TEMPERATURE; INORGANIC OXIDES; INTERFACES; INTERFACIAL CONTROL; MATRIX; MAXWELL-WAGNER RELAXATION; PARTICLE COMPOSITES; PARTICLE DISPERSION; PARTICLE SURFACE; POLYMER GLASS TRANSITION; PURE POLYMERS; REDUCED SENSITIVITY; SURFACE MODIFICATION; THERMOSETTING EPOXY POLYMERS; WEIBULL;

DIELECTRIC PROPERTIES OF SOLIDS; DISPERSIONS; ELECTRIC BREAKDOWN; GLASS; GLASS BONDING; GLASS TRANSITION; NANOCOMPOSITES; ORGANIC POLYMERS; PERMITTIVITY; POLYMER MATRIX; SOLVENTS; TEMPERATURE; THERMOSETS;

POLYMER MATRIX COMPOSITES;

EID: 77956911613     PISSN: 09276440     EISSN: 15685543     Source Type: Journal    
DOI: 10.1163/092764410X495315     Document Type: Article

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