SCOPUS 정보 검색 플랫폼

1st International Conference on Green Circuits and Systems, ICGCS 2010

Volumn , Issue , 2010, Pages 5-8

Green energy harvesting technology in 3D IC

(2) Wang, Wei a Teh, Weng Hong b,c

a STATE UNIVERSITY OF NEW YORK (United States)

b SEMATECH (United States)

c INTEL CORPORATION (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; BREAKTHROUGH TECHNOLOGY; FUTURE APPLICATIONS; GREEN ENERGY; MEMORY LAYERS; MEMORY OPERATIONS; SEMICONDUCTOR INDUSTRY; TEMPERATURE DIFFERENCES; THREE DIMENSIONAL INTEGRATED CIRCUITS (3-D IC);

ALTERNATIVE FUELS; HARVESTING; INNOVATION; SEMICONDUCTOR DEVICE MANUFACTURE; TECHNOLOGY; THERMOCOUPLES; THERMOMETERS; THREE DIMENSIONAL;

ENERGY HARVESTING;

EID: 77956586696 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ICGCS.2010.5543108 Document Type: Conference Paper

Times cited : (6)

References (11)

1
- 33744980462
- Design for green electronics, a great potential is still ahead
- March
- Y. Li, N. D. Caluwe, and P. Stevels Philips, "Design for green electronics, a great potential is still ahead" in: Proc. of International Conference on Asian Green Electronics, pp. 14-24, March 2005.
- (2005) Proc. of International Conference on Asian Green Electronics , pp. 14-24
- Li, Y.¹ Caluwe, N.D.² Philips, S.P.³

2
- 77956592023
- Butterworth-Heineman
- Lee Goldberg, Green electronics/green bottom line: environmentallly responsible engineering, Butterworth-Heineman, 2000.
- (2000) Green Electronics/Green Bottom Line: Environmentallly Responsible Engineering
- Goldberg, L.¹

3
- 77956564870
- Nanotechnology News
- Nanotechnology News: "Breakthrough 3D IC technology enabling low-cost memories and high-performance logic products", 2008.
- (2008) Breakthrough 3D IC Technology Enabling Low-Cost Memories and High-Performance Logic Products

4
- 33747566850
- 3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
- K. Banerjee, S. J. Souri, P. Kapur, and K. C. Saraswat, "3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration," in: Proc. of the IEEE, vol. 89, no. 5, pp. 602-633, 2001.
- (2001) Proc. of the IEEE , vol.89 , Issue.5 , pp. 602-633
- Banerjee, K.¹ Souri, S.J.² Kapur, P.³ Saraswat, K.C.⁴

5
- 28344452134
- Demystifying 3D ICs: The pros and cons of going vertical
- W. R. Davis, J. Wilson, S. Mick, J. Xu, H. Hua, C. Mineo, A. M. Sule, M. Steer, and P. D. Franzon, "Demystifying 3D ICs: the pros and cons of going vertical," IEEE Design & Test of Computers, vol. 22, no. 6, pp. 498-510, 2005.
- (2005) IEEE Design & Test of Computers , vol.22 , Issue.6 , pp. 498-510
- Davis, W.R.¹ Wilson, J.² Mick, S.³ Xu, J.⁴ Hua, H.⁵ Mineo, C.⁶ Sule, A.M.⁷ Steer, M.⁸ Franzon, P.D.⁹

6
- 33845237994
- "International technology roadmap for semiconductors," http://public.itrs.net, 2007.
- (2007) International Technology Roadmap for Semiconductors

7
- 23844480399
- Analysis of thermoelectric coolers by a spice-compatible equivalent-circuit model
- S. Lineykin, S. Ben-Yaakov, "Analysis of thermoelectric coolers by a spice-compatible equivalent-circuit model," IEEE Power Electronics Letters, vol. 3, no. 2, pp. 63-66, 2005.
- (2005) IEEE Power Electronics Letters , vol.3 , Issue.2 , pp. 63-66
- Lineykin, S.¹ Ben-Yaakov, S.²

8
- 34147170930
- Optimal pellet geometries for thermoelectric refrigeration
- M. Hodes, "Optimal pellet geometries for thermoelectric refrigeration," IEEE Trans. on Electron Devices, vol. 55, pp. 50-58, 2007.
- (2007) IEEE Trans. on Electron Devices , vol.55 , pp. 50-58
- Hodes, M.¹

9
- 18944401236
- Thermo-electric characterization of APCVD PolySi/sub 0.7/ge/sub 0.3/ for IC-compatible fabrication of integrated lateral thermocouple elements
- D. D. L. Wijngaards, R. F. Wolffenbuttel, "Thermo-electric characterization of APCVD PolySi/sub 0.7/Ge/sub 0.3/for IC-compatible fabrication of integrated lateral Thermocouple elements." IEEE Trans, on Electron Devices, vol. 52, no. 5, pp. 1014-1025, 2005.
- (2005) IEEE Trans. on Electron Devices , vol.52 , Issue.5 , pp. 1014-1025
- Wijngaards, D.D.L.¹ Wolffenbuttel, R.F.²

10
- 0033301073
- Development of quantum well thermoelectric deviced
- S. Ghamaty, N. Eisner, "Development of quantum well thermoelectric device" in: Proc. of International Conference on Thermoelectrics, pp.485-488, 1999.
- (1999) Proc. of International Conference on Thermoelectrics , pp. 485-488
- Ghamaty, S.¹ Eisner, N.²

11
- 77956605969
- http://er.cs.ucla.edu/benchmarks/ibm-place/

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.