Microchemical and microstructural changes of nano-TiN powder during vacuum heat treatment

Journal of Alloys and Compounds

Volumn 506, Issue 2, 2010, Pages 693-697

  Xiong, Ji ^a   Guo, Zhixing ^a   Yang, Mei ^b   Xiong, Sujian ^a   Chen, Jianzhong ^a   Fan, Hongyuan ^a   Feng, Keqin ^a   Sun, Lan ^a   Wang, Jun ^a   Wang, Hui ^a  

^a SICHUAN UNIVERSITY   (China)

^b CHENGDU UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Nano TiN powder; Transmission electron microscopy (TEM); Vacuum heat treatment; X ray photoelectron spectroscopy (XPS)

Indexed keywords

AFTER-HEAT TREATMENT; AVERAGE PARTICLE SIZE; CHEMICAL COMPOSITIONS; FACE-CENTERED CUBIC STRUCTURE; IN-VACUUM; LATTICE PARAMETERS; MICROSTRUCTURAL CHANGES; NANO-TIN; OXYGEN CONTENT; SURFACE CHEMICAL COMPOSITION; TEM; VACUUM HEAT TREATMENT; XPS; XRD;

HEAT TREATMENT; LATTICE CONSTANTS; MORPHOLOGY; OXYGEN; PHOTOELECTRICITY; PHOTONS; TIN POWDER METALLURGY; TRANSMISSION ELECTRON MICROSCOPY; VACUUM; VACUUM TECHNOLOGY; X RAY PHOTOELECTRON SPECTROSCOPY;

TITANIUM NITRIDE;

EID: 77956469095     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.07.045     Document Type: Article

References (20)

1. S. Kang Powder Metall. 40 1997 139 142
2. H. Pastor Mater. Sci. Eng. A 105/106 1988 401 409
3. K. Niihara Powder Metall. 44 1997 887 896
4. X.B. Zhang, and N. Liu Int. J. Refract. Met. H 26 2008 575 582
5. Y. Zheng, W.H. Xiong, W.J. Liu, W. Lei, and Q. Yuan Ceram. Int. 31 2005 165 170
6. N. Liu, Y.D. Xu, H. Li, G.H. Li, and L.D. Zhang J. Eur. Ceram. Soc. 22 2002 2409 2414
7. N. Liu, Y.D. Xu, H. Li, Z.H. Li, Y. Zhao, and G.H. Li Mater. Sci. Technol. 18 2002 586 590
8. B.J. Briscoe, A.U. Khan, and P.F. Luckham J. Eur. Ceram. Soc. 18 1998 2141 2147
9. C.J. Shih, B.H. Lung, and M.H. Hon Mater. Chem. Phys. 60 1999 150 157
10. Y. Zhao, C.L. Wang, and K.N. Yang Powder Metall. Technol. 21 2003 145 150
11. M.S. Wang, X.Y. Song, and S.X. Zhao J. Funct. Mater. 38 2007 1519 1522
12. Z.G. Guo, J. Xiong, Mei Yang, S.J. Xiong, J.Z. Chen, and Y.M. Wu. J. Alloys Compd. 493 2010 362 367
13. N.C. Saha, and H.G. Tompkins J. Appl. Phys. 72 1992 3072 3079
14. M.Z. Atashbar, H.T. Sun, B. Gong, W. Wlodarski, and R. Lamb Thin Solid Films 326 1998 238 244
15. F.H. Lu, and H.Y. Chen Thin Solid Films 355-356 1999 374 379
16. J.X. Zhang, L.P. Duan, D.L. Jiang, Q.L. Lin, and M. Iwasa J. Colloid Interface Sci. 286 2005 209 215
17. N. Setoudeh, A. Saidi, and N.J. Welham J. Alloys Compd. 390 2005 138 143
18. N. Setoudeh, A. Saidi, and N.J. Welham J. Alloys Compd. 419 2006 247 250
19. Y.X. Li, J.D. Hu, H.Y. Wang, Z.X. Guo, and A.N. Chumakov Mater. Sci. Eng. A 458 2007 235 239
20. A.M. Hindeleh, and D.J. Johnson Polymer 21 1980 929 935