Electroless ternary Ni-W-P alloys containing micron size Al2O3 particles

Surface and Coatings Technology

Volumn 205, Issue 2, 2010, Pages 575-581

  Balaraju, J N ^a   Kalavati, ^a   Rajam, K S ^a  

^a SURFACE ENGINEERING DIVISION   (India)

Author keywords

Al2O3; Composite; Electroless nickel; Ternary NiWP

Indexed keywords

AL2O3; ALUMINA PARTICLES; ALUMINUM OXIDE PARTICLES; COATING THICKNESS; CODEPOSITION; COMPOSITE; ELECTROLESS; ELECTROLESS NICKEL; ELECTROLESS NICKEL BATHS; ELEMENTAL ANALYSIS; ENERGY DISPERSIVE X-RAY; EXOTHERMIC PEAK TEMPERATURE; GRAIN SIZE; MATRIX; MICRON SIZE; MILD STEEL; NANOCRYSTALLINES; NODULARITY; PHASE TRANSFORMATION; SCANNING ELECTRON MICROSCOPES; SECOND PHASE; SUBSTRATE MATERIAL; TERNARY NIWP; THERMAL STABILITY; UNIFORM DISTRIBUTION; X-RAY AMORPHOUS; XRD STUDIES;

ALUMINUM; ALUMINUM COATINGS; CARBON STEEL; DEPOSITS; METASTABLE PHASES; NANOCRYSTALLINE ALLOYS; NICKEL; NICKEL COATINGS; OXIDES; SCANNING ELECTRON MICROSCOPY; SURFACE ANALYSIS; THICKNESS MEASUREMENT; X RAY DIFFRACTION; X RAYS;

COMPOSITE COATINGS;

EID: 77956423483     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.07.047     Document Type: Article

References (29)

1. Osaka T., Yamazaki H., Saito I., Kawaguchi J. J. Electrochem. Soc. 1989, 136(11):3418.
2. Wu F.B., Tien S.K., Chen W.Y., Duh J.G. Surf. Coat. Tech. 2004, 177-178:312.
3. Li J., Hu X., Wang D. Plat. Surf. Finish. 1996, 83:62.
4. Tien S.K., Duh J.G., Chen Y.I. Thin Solid Films 2004, 469-470:268.
5. Balaraju J.N., Ezhil Selvi V., William Grips V.K., Rajam K.S. Electrochim. Acta 2006, 52:1064.
6. Aoki K., Takano O. Plat. Surf. Finish. 1990, 77:48.
7. Valova E., Armyanov S., Franquet A., Hubin A., Steenhaut O., Delplancke J.L., Vereecken J. J. Appl. Electrochem. 2001, 31:1367.
8. Balaraju J.N., Anandan C., Rajam K.S. Surf. Eng. 2005, 21(3):215.
9. Song Z., Bao X., Muhler M. App. Surf. Sci. 1999, 148:241.
10. Grosjean A., Rezrazi M., Tachez M. Surf. Coat. Tech. 1997, 96:300.
11. Ge J.-P., Che R.X., Wang X.Z. Plat. Surf. Finish. 1998, 85:69.
12. Balaraju J.N., Rajam K.S. J. Alloys Compd. 2008, 459(1-2):311.
13. Balaraju J.N., Kalavati, Rajam K.S. Surf. Coat. Tech. 2006, 200:3933.
14. Balaraju J.N., Sankara Narayanan T.S.N., Sheshadri S.K. J. App. Chem. 2003, 33:807.
15. Liu Y., Zhao Q. Plat. Surf. Finish. 2004, 4:48.
16. Jiaqiang Gao, Lei Liu, Yating Wu, Bin Shen, Wenbin Hu Surf. Coat. Technol. 2006, 200(20-21):5836.
17. Sarret M., Muller C., Amell A. Surf. Coat. Technol. 2006, 201(1-2):389.
18. Zuleta A.A., Galvis O.A., Castaño J.G., Echeverría F., Bolivar F.J., Hierro M.P., Pérez-Trujillo F.J. Surf. Coat. Technol. 2009, 203:3569.
19. Nova'k M., Vojtěch D., Vi{dotless}'tu T. App. Surf. Sci. 2010, 256:2956.
20. Hamid Z.A., El-Adly R.A. Plat. Surf. Finish. 1999, 86:136.
21. Monir Vaghefi S.M., Saatchi A. Ebrahimian-Hoseinabadi.M. Surf. Coat. Technol. 2003, 168:259.
22. Wu.Yucheng, Li Guanghai, Zhang Lide, Yan Bo, Z. Metallkd., Vol. 91, No. 9, 2000, pp 788.
23. Goldenstein A.W., Rostoker W., Schlossberger F., Gutzeit G. J. Electrochem. Soc. 1957, 104:104.
24. Ogburn F., Johnson C.E. Plating 1973, 60:1043.
25. Nee C.C., Weil R. Surf. Technol. 1985, 25:7.
26. Keong K.G., Sha W., Malinov S. J. Alloys Compd. 2002, 334:192.
27. Yong-jun Hu., Wang Tian-xu, Meng Ji-long, Rao Qian-yang Surf. Coat. Technol. 2006, 201:988.
28. Park S.H., Lee D.N. J. Mat. Sci. 1988, 23:1643.
29. Rajam K.S., Rajagopal I., Rajagopalan S.R., Viswanathan B. Mater. Chem. Phys. 1993, 33:289.