Effect of coefficient of thermal expansion on positive temperature coefficient of resistivity behavior of HDPE-Cu composites

Journal of Applied Polymer Science

Volumn 118, Issue 2, 2010, Pages 950-959

  Kar, Prativa ^a   Khatua, B B ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY   (India)

Author keywords

[No Author keywords available]

Indexed keywords

CLAY COMPOSITES; COEFFICIENT OF THERMAL EXPANSION; MELTING TEMPERATURES; NANO CLAYS; POSITIVE TEMPERATURE COEFFICIENT OF RESISTIVITIES; ROOM-TEMPERATURE RESISTIVITY; STORAGE MODULI; THERMAL STABILITY;

CARBON BLACK; MELTING POINT; METAL MELTING; NANOCOMPOSITES; NANOSTRUCTURED MATERIALS; PLATINUM COMPOUNDS; POSITIVE TEMPERATURE COEFFICIENT; THERMAL STRESS; THERMODYNAMIC STABILITY;

THERMAL EXPANSION;

EID: 77956245806     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.32455     Document Type: Article

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