Compact nanostructure integrated pool boiler for microscale cooling applications

Micro and Nano Letters

Volumn 5, Issue 4, 2010, Pages 203-206

  Sesen M ^a   Khudhayer, W ^b   Karabacak, T ^b   Kosar A ^a  

^a SABANCI UNIVERSITY   (Turkey)

^b University of Arkansas   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE DIAMETER; BASE PLATES; BOILING HEAT TRANSFER; BUBBLE MOTION; COOLING APPLICATIONS; COPPER NANORODS; COPPER THIN FILM; EXTERNAL ENERGY; MICRO ELECTRO MECHANICAL SYSTEM; MICRO-SCALES; MICROSYSTEM APPLICATIONS; NANO-STRUCTURED; NANOSTRUCTURED SURFACE; PHASE CHANGE; PLATE SURFACES; SILICON WAFER SURFACE; SURFACE TEMPERATURES; WORKING FLUID;

BOILING LIQUIDS; COOLING; COOLING SYSTEMS; ENERGY UTILIZATION; ETHANOL; MEMS; MICROELECTROMECHANICAL DEVICES; NANORODS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

LAKES;

COPPER; NANOROD;

ARTICLE; COOLING; FILM COATING; HEAT TRANSFER; MICROELECTROMECHANICAL SYSTEM; MICROPROCESSOR; NANOENGINEERING; NANOFABRICATION; PHASE TRANSITION; SURFACE PROPERTY;

EID: 77956245338     PISSN: None     EISSN: 17500443     Source Type: Journal    
DOI: 10.1049/mnl.2010.0070     Document Type: Article

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