Cure kinetics of PF/PVAc hybrid adhesive for manufacturing profiled wood-strand composites

Holzforschung

Volumn 64, Issue 5, 2010, Pages 603-608

  Wang, Yi ^a   Yadama, Vikram ^a   Laborie, Marie Pierre ^a   Bhattacharyya, Debes ^b  

^a Washington State University   (United States)

^b UNIVERSITY OF AUCKLAND   (New Zealand)

Author keywords

bonding; Borchardt Daniels model; cure kinetics; differential scanning calorimetry; hybrid adhesive; phenol formaldehyde; poly(vinyl acetate); profile forming; wood strand

Indexed keywords

CURE KINETICS; DANIELS; HYBRID ADHESIVE; PHENOL FORMALDEHYDE; PROFILE FORMING;

CALORIMETERS; DIFFERENTIAL SCANNING CALORIMETRY; FORMALDEHYDE; HOT PRESSING; PHENOLS; REACTION KINETICS; RESINS; ROLL BONDING; SCANNING; THERMOFORMING; WOOD;

CURING;

ADHESIVES; BONDING; CALORIMETERS; CALORIMETRY; CURING; FORMALDEHYDE; FORMING; HOT FORMING; HOT PRESSING; KINETICS; PHENOLS; POLYPHENOLICS; POLYVINYL ACETATE; REACTION KINETICS; WOOD;

EID: 77956218754     PISSN: 00183830     EISSN: 1437434X     Source Type: Journal    
DOI: 10.1515/HF.2010.079     Document Type: Article

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