Corona discharge assisted thermal bonding of polymer microfluidic devices

Microsystem Technologies

Volumn 16, Issue 7, 2010, Pages 1181-1186

  Ng, Sum Huan ^a   Wu, Yexian ^a   Wang, Zhenfeng ^a   Wang, Zhiping ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING CONDITIONS; BONDING PRESSURE; BONDING STRENGTH; BONDING TEMPERATURES; CONTACT PRESSURES; CORONA DISCHARGES; CROSS SECTION; DIFFUSION MECHANISMS; GAUGE PRESSURE; HYDROPHILIC SURFACES; LOWER PRESSURES; MICROFLUIDIC CHIP; POLYMER MICROFLUIDICS; RECTANGULAR SHAPES; THERMAL BONDING; WAFER SCALE; WATER CONTACT ANGLE;

CONTACT ANGLE; DIFFUSION BONDING; ELECTRIC CORONA; FLUIDIC DEVICES; MICROCHANNELS; MICROFLUIDICS; PRESSURE EFFECTS; SURFACE TREATMENT;

WAFER BONDING;

EID: 77955849408     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-009-0937-8     Document Type: Conference Paper

References (6)

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