Electrothermal polymer nanocomposite actuators

Advanced Materials

Volumn 22, Issue 31, 2010, Pages 3430-3435

  Sellinger, Aaron T ^a   Wang, David H ^b   Tan, Loon Seng ^a   Vaia, Richard A ^a  

^a AIR FORCE RESEARCH LABORATORY   (United States)

^b UNIVERSITY OF DAYTON RESEARCH INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATOR GEOMETRY; MECHANICAL SOFTENING; NANOFILLER; POLYMER NANOCOMPOSITE; THERMOMECHANICAL PROCESS;

ACTUATORS; CONDUCTIVE FILMS; POLYMER FILMS; THERMAL EXPANSION;

NANOCOMPOSITES;

CARBON NANOTUBE; IMIDE; NANOCOMPOSITE; POLYMER;

ARTICLE; CHEMISTRY; ELECTRIC CONDUCTIVITY; MECHANICS; TEMPERATURE;

ELECTRIC CONDUCTIVITY; IMIDES; MECHANICAL PROCESSES; NANOCOMPOSITES; NANOTUBES, CARBON; POLYMERS; TEMPERATURE;

EID: 77955701761     PISSN: 09359648     EISSN: 15214095     Source Type: Journal    
DOI: 10.1002/adma.200904107     Document Type: Article

References (25)

1. R. Vaia, J. Baur, Science 2008, 319, 420.
2. Y. Bar-Cohen, Electroactive Polymer (EAP) Actuators as Artificial Muscles: Reality, Potential, and Challenges, SPIE Press, Bellingham, Washington 2004.
3. S. Courty, J. Mine, A. R. Tajbakhsh, E. M. Terentjev, Europhys. Lett. 2003, 64, 654.
4. S. Zhang, N. Zhang, C. Huang, K. Ren, Q. Zhang, Adv. Mater. 2005, 17, 1897.
5. C. Li, E. T. Thostenson, T. W. Chou, Compos. Sci. Technol. 2008, 68, 1227.
6. C. Park, J. H. Kang, J. S. Harrison, R. C. Costen, S. E. Lowther, Adv. Mater. 2008, 20, 2074.
7. L. Qu, Q. Peng, L. Dai, G. M. Spinks, G. G. Wallace, R. H. Baughman, MRS Bullet. 2008, 33, 215.
8. NASA, Elastic Memory Composite Hinges Tested on the Shuttle, NASA Tech. Briefs 2007, 31, 20.
9. H. Koerner, G. Price, N. A. Pearce, M. Alexander, R. A. Vaia, Nat. Mater. 2004, 3, 115.
10. Z. Yang, G. A. Herd, S. M. Clarke, A. R. Tajbakhsh, E. M. Terentjev, W. T. S. Huck, J. Am. Chem. Soc. 2006, 128, 1074.
11. K. K. Hon, D. Corbett, E. M. Terentjev, Eur. Phys. J. E2008, 25, 83.
12. M. Kato, M. Ishibashi, J. Phys. Conf. Ser. 2008, 127, 012003.
13. L. Z. Chen, C. H. Liu, C. H. Hu, S. S. Fan, Appl. Phys. Lett. 2008, 92, 263104.
14. D. Lide, CRC Handbook of Chemistry and Physics, CRC Press, Boca Raton, Florida, 2008.
15. M. Ohring, Engineering Materials Science, Academic Press, San Diego, California, 1995.
16. P. S. O'Patricio, H. D. R. Calado, F. A. C. de Oliveira, A. Righi, B. R. A. Neves, G. G. Silva, L. A. Cury, J. Phys.: Condens. Matter 2006, 18, 7529.
17. S. Marchant, P. J. S. Foot, Mat. Sci. Eng. B - Solid 1991, 9, 269.
18. M. M. Erwin, J. McBride, A. V. Kadavanich, S. J. Rosenthal, Thin Solid Films 2002, 409, 198.
19. D. Y. Khang, J. A. Rogers, H. H. Lee, Adv. Funct. Mater. 2008, 18, 1.
20. M. J. Arien, D. Wang, J. D. Jacobs, R. Justice, A. Trionfi, J. W. P. Hsu, D. Schaefer, L. S. Tan, R. A. Vaia, Macromolecules 2008, 41, 8053.
21. G. D. Raithby, K. G. T. Hollands, Handbook of Heat Transfer Fundamentals, McGraw-Hill Inc., New York, New York, 1985, pp 6-16-6-20.
22. F. P. Beer, E. R. Johnston, Mechanics of Materials, McGraw-Hill Inc., New York, New York, 1981, pp 526-534.
23. F. L. Singer, Strength of Materials, Harper and Brothers, New York, New York, 1962, pp 245-265.
24. F. P. Beer, E. R. Johnston, E. R. Eisenberg, W. E. Clausen, G. H. Staab, Vector Mechanics for Engineers, Statics and Dynamics, McGrawHill Inc., New York, New York, 2003, pp 394.
25. C. Bas, C. Tamagna, T. Pascal, N. D. Alberola, Polym. Eng. Sci. 2003, 43, 344.