Curing behaviour of polycyanate ester/o-cresol formaldehyde epoxy resin composite system

Iranian Polymer Journal (English Edition)

Volumn 19, Issue 6, 2010, Pages 469-477

  Pi, Pihui ^a   Lin, Weichuang ^a   Zheng, Dafeng ^a   Wang, Zhaimin ^a   Wen, Xiufang ^a   Cheng, Jiang ^a   Yang, Zhuoru ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Curing kinetics; Curing process; DSC TG analysis; Kissinger method; PCE OCFEP composite system

Indexed keywords

COMPOSITE SYSTEMS; CURING KINETICS; CURING PROCESS; DSC/TG ANALYSIS; KISSINGER METHODS;

ACTIVATION ENERGY; CURING; DIAMOND CUTTING TOOLS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC NETWORK ANALYSIS; ELECTRONICS INDUSTRY; ESTERS; FORMALDEHYDE; INK; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PROCESSING; REACTION KINETICS; RESINS; THERMAL INSULATION; THERMODYNAMIC STABILITY;

EPOXY RESINS;

EID: 77955671598     PISSN: 10261265     EISSN: 10261265     Source Type: Journal    
DOI: None     Document Type: Article

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