Non-isothermal cure kinetics of diglycidyl ether of bisphenol-A with various aromatic diamines

Iranian Polymer Journal (English Edition)

Volumn 18, Issue 6, 2009, Pages 431-443

  Barghamadi, Mohamad ^a   Ghaemy, Mousa ^b   Alizadeh, Raouf ^b  

^a ISLAMIC AZAD UNIVERSITY   (Iran)

^b UNIVERSITY OF MAZANDARAN   (Iran)

Author keywords

Curing; DSC; Epoxy resin; Kinetics; Non isothermal

Indexed keywords

AROMATIC DIAMINE; BISPHENOL A; CONVERSION EQUATION; CURE KINETICS; CURING AGENTS; CURING KINETICS; DIGLYCIDYL ETHER; DIGLYCIDYL ETHER OF BISPHENOL-A; DSC; EXOTHERMIC PEAKS; K-VALUES; KISSINGER; KISSINGER METHODS; NON-ISOTHERMAL; OZAWA METHOD; PREEXPONENTIAL FACTOR; WEIGHT LOSS;

ACTIVATION ENERGY; AMINES; DIFFERENTIAL SCANNING CALORIMETRY; DIGITAL INTEGRATED CIRCUITS; EPOXY RESINS; ETHERS; PHENOLS; RATE CONSTANTS; REACTION KINETICS; RESINS;

CURING;

EID: 67650753946     PISSN: 10261265     EISSN: 10261265     Source Type: Journal    
DOI: None     Document Type: Article

References (36)

1. Peltola J, Cao Y, Smith P, Adhesives made with inherently conducting polymers, Adhes Age, 39, 18-20, 1995.
2. Pascual SV, Martin MJM, Influence of the curing temperature in the mechanical and thermal properties of nanosilica filled epoxy resin coating, Macromol Symp, 233, 137-1136, 2006.
3. Lee LH, Mechanisms of thermal degradation of phenolic condensation polymers. II. Thermal stability and degradation schemes of epoxy resins, J Polym Sci A Poly Chem, 3, 859-882, 1965.
4. 4. Maity T, Samanta BC, Dalai S, Banthia AK, Curing study of epoxy resin by new aromatic amine functional curing agents along with mechanical and thermal evaluation, Mater Sci Eng A, 464, 38-46, 2007. (Pubitemid 46760299)
5. Bansal RK, Agrawal R, Keshav K, Epoxy resins. VIII: thermal properties of 4,4-sulfonyldiphenol and bisphenol a epoxy resins, Angew Makromol Chem, 117,211-218, 1983.
6. Musto P, Martuscelli RG, Russo P, Villano P, Tetrafunctional epoxy resins: modeling the curing kinetics based on FTIR spectroscopy data, J Appl Polym Sci, 74, 532-540, 1999.
7. 7. Carrasco F, Pages P, Lacorte T, Briceno K, Fourier transform IR and differential scanning calorimetry study of curing of trifunctional amino-epoxy resin, J Appl Polym Sci, 98, 1524-1535, 2005. (Pubitemid 41634441)
8. Chen WY, Wang YZ, Chang FC, Study on curing kinetics and curing mechanism of epoxy resin based on diglycidyl ether of bisphenol A and melamine phosphate, J Appl Polym Sci, 92, 892-900, 2004.
9. Liu Y, Zhang C, Du Z, Li H, Preparation and curing kinetics of bisphenol A type novolac epoxy resins, J Appl Polym Sci, 99, 858-1568, 2006.
10. 10. Ghaemy M, Barghamadi M, Behmadi H, Cure kinetics of epoxy resin and aromatic diamines, J Appl Polym Sci, 94, 1049-1056, 2004. (Pubitemid 39394560)
11. 11. Ghaemy M, Barghamadi M, Behmadi H, Nonisothermal cure kinetics of DGEBA with novel aromatic diamine, J Appl Polym Sci, 103, 3076-3083, 2007. (Pubitemid 46345594)
12. 12. Ghaemy M, Amini Nasab SM, Barghamadi M, Preparation and nonisothermal cure kinetics of DGEBA-nanosilica particles composites, Polym Composite, 29, 165-172, 2008. (Pubitemid 351281250)
13. 13. Jain R, Kukreja P, Narula AK, Chaudhary V, Studies of the curing kinetics and thermal stability of epoxy resins using a mixture of amines and anhydrides, J Appl Polym Sci, 100, 39193925, 2006. (Pubitemid 43666788)
14. 14. Mijovic J, Kim J, Slaby J, Cure kinetics of epoxy formulations of the type used in advanced composites, J Appl Polym Sci, 29, 1449-1462, 1984. (Pubitemid 14544345)
15. 15.LuMG,ShimMJ,KimSW, DynamicDSCcharacterizationofepoxyresinbymeansoftheavramiequation, JThermAnalCalorim,58,701709,1999.(Pubitemid30561241)
16. 16. Zhang XH, Min YQ, Zhao H, Wan HM, Qi GR, Novel nitrogen-containing epoxy resin. II: cure kinetics by differential scanning calorimetry, J Appl Polym Sci, 100, 3483-3489, 2006. (Pubitemid 43666732)
17. 17. Ghaemy M, Omrani A, Rostami AA, Study of reaction kinetics of epoxy and a nickel(II) complex using dynamic DSC technique, J Appl Polym Sci, 97, 265-271, 2005. (Pubitemid 40844189)
18. Ghaemy M, Sadjady S, Kinetic analysis of curing behavior of diglycidyl ether of bisphenol A with imidazoles using differential scanning calorimetry techniques, J Appl Polym Sci, 100, 2634-2641, 2006.
19. Chen JP, Natansohn A, Synthesis and characterization of novel carbazole-containing soluble polyimides, Macromolecules, 32, 3171-3177, 1999.
20. Grotta HM, Riggle CJ, Bearse AE, Dinitrocarbazoles, J Org Chem, 29, 2474-2476, 1964.
21. Sang HL, Tetsuo T, Molecular design of fluorenebased polymers and oligomers for organic light-emitting diodes, Thin Solid Films, 363, 76-80, 2000.
22. 22. Mishra AK, Jacob J, Mullen K, Synthesis of aminocarbazole anthraquinone fused dyes and polymers, Dyes Pigm, 75, 1-10, 2007. (Pubitemid 46554992)
23. 23. Klapars A, Huang X, Buchwald SL, A general and efficient copper catalyst for the amidation of aryl halides, J Am Chem Soc, 124, 74217428, 2002. (Pubitemid 34670450)
24. 24.GhaemyM,BarghamadiM,BehmadiH, Studiesofcurekineticsandchemicalresistance ofthecuredproductsofDGEBAwitharomaticdiamines,IranPolymJ,15,375-383,2006. (Pubitemid44186023)
25. Ghaemy M, Rahpaima G, Behmadi H, Effect of triphenylphosphine on the cure reaction and thermal stability of diglycidyl ether of bisphenol Abased epoxy resin, Iran Polym J, 17, 875-885, 2008.
26. Ghaemy M, Hassanpour-Shahriari A, Study of the cure reaction of DGEBA/ABS blend in the presence of an aromatic diamine, Iran Polym J, 17, 395-405, 2008.
27. Palaniappan S, Sreedhar B, Nair Smitha M, Polyaniline as a curing agent for epoxy resin: cure kinetics by differential scanning calorimetry, Macromol Chem Phys, 202, 1227-1231, 2001.
28. Ampudia J, Larrauri E, Gil EM, Rodriguez M, Leon LM, Thermal scanning rheometric analysis of curing kinetic of an epoxy resin. I: an anhydride as curing agent, J Appl Polym Sci, 71, 1239-1245, 1999.
29. Lu MG, Shim MJ, Kim SW, Effect of filler on cure behavior of an epoxy system: cure modeling, Polym Eng Sci, 39, 274-285, 1999.
30. 30. Zvetkov VL, Comparative DSC kinetics of the reaction of DGEBA with aromatic diamines. I: non-isothermal kinetic study of the reaction of DGEBA with m-phenylene diamine, Polymer, 42,6687-6697,2001. (Pubitemid 32441136)
31. Kissinger HE, Reaction kinetics in differential thermal analysis, Anal Chem, 29, 1702-1706, 1957.
32. Gu J, Narang SC, Pearce EM, Curing of epoxy resins with diphenyliodonium salts as thermal initiators, J Appl Polym Sci, 30, 2997-3007,1985.
33. Ozawa T, Kinetic analysis of derivative curves in thermal analysis, J Therm Anal Calorim, 2, 301-324, 1970.
34. 34. Moroni A, Mijovic J, Pearce E, Foun CC, Cure kinetics of epoxy resins and aromatic diamines, J Appl Polym Sci, 32, 3761-3773, 1986. (Pubitemid 16609842)
35. Salla JM, Ramis X, Morancho JM, Cadenato A, Isoconversion kinetic analysis of a carboxyl terminated polyester resin crosslinked with triglycidyl isocyanurate (TGIC) used in powder coatings from exprimental results obtained by DSC and TMDSC, Thermochim Acta, 388, 355-370, 2002.
36. 36. Zhou TL, Gu MY, Jin YP, Wang JX, Isoconversional method to explore the cure reaction mechanisms and curing kinetics of DGEBA/EMI-2,4/nano-SiC system, J Polym Sci A Poly Chem, 44, 371-379, 2006. (Pubitemid 43059920)