Evaluation of cure shrinkage measurement techniques for thermosetting resins

Polymer Testing

Volumn 29, Issue 6, 2010, Pages 629-639

  Shah, Darshil U ^a   Schubel, Peter J ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

Chemical shrinkage; Cure behavior; Pycnometer; Rheometer; Thermal analysis; Thermosetting resins

Indexed keywords

CHEMICAL SHRINKAGE; CURE BEHAVIOR; CURE PROCESS; CURE SHRINKAGE MEASUREMENT; CURING SYSTEM; ELEVATED TEMPERATURE; EPOXY SYSTEMS; POST-CURE; PYCNOMETRIC METHOD; ROBUST TECHNIQUE; SHRINKAGE MEASUREMENTS; SURFACE FAILURE; SURFACE INTEGRITY; SURFACE QUALITIES; THERMAL ANALYSIS; THERMOMECHANICAL ANALYZERS; THERMOSETTING RESINS;

CURING; EPOXY RESINS; HELIUM; RESINS; RHEOMETERS; STRUCTURE (COMPOSITION); THERMOANALYSIS; THERMOSETS;

SHRINKAGE;

EID: 77955430996     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2010.05.001     Document Type: Article

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