Atomistic simulation of hillock growth

Acta Materialia

Volumn 58, Issue 16, 2010, Pages 5471-5480

  Frolov, T ^a   Boettinger, W J ^b   Mishin, Y ^a  

^a GEORGE MASON UNIVERSITY   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Compressive stress; Grain boundary diffusion; Hillock; Molecular dynamics; Whisker

Indexed keywords

ACCRETION RATE; ATOMISTIC SIMULATIONS; FREE SURFACES; GRAIN BOUNDARY MOTIONS; GRAIN-BOUNDARY DIFFUSION; HILLOCK; HILLOCK GROWTH; IN-PLANE BIAXIAL COMPRESSION; INTERNAL STRESS; MOLECULAR DYNAMICS SIMULATIONS; POLYCRYSTALLINE FILM; SIMULATED GRAINS; TRIPLE LINES; UPWARD MOTION; WHISKER GROWTH;

COMPRESSIVE STRESS; DIFFUSION; DYNAMICS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MOLECULAR DYNAMICS; SEED; TENSILE STRESS;

GRAIN GROWTH;

EID: 77955424106     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.06.023     Document Type: Article

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