Design and test of carbon nanotube biwick structure for high-heat-flux phase change heat transfer

Journal of Heat Transfer

Volumn 132, Issue 5, 2010, Pages 1-8

  Cai, Qingjun ^a   Chen, Chung Lung ^a  

^a ROCKWELL SCIENTIFIC COMPANY   (United States)

Author keywords

Carbon nanotube; Thermometer; Wick structure

Indexed keywords

A-THERMAL; ANNEALING PROCESS; CAPILLARY FORCE; COMPACT ELECTRONICS; COOLING TECHNOLOGY; DIRECT HEATING; ELECTRICAL LEAKAGE; FLUX CHARACTERISTICS; FLUX PHASE; HEAT SPREADERS; HIGH THERMAL CONDUCTIVITY; MASS TRANSPORT; MICROELECTRONIC INDUSTRY; NANOPORE SIZE; PLATINUM WIRE; POROUS MEDIA; POWER CONSUMPTION; RESISTANCE VARIATIONS; SILICON SUBSTRATES; THERMAL MANAGEMENT; THERMALLY OXIDIZED; THERMALLY OXIDIZED SILICON; WICK STRUCTURE; WICK STRUCTURES;

CARBON NANOTUBES; COOLING; HEAT EXCHANGERS; MICROELECTRONICS; NANOPORES; PLATINUM; POROUS MATERIALS; SILICON OXIDES; TEMPERATURE MEASUREMENT; TEMPERATURE SENSORS; THERMAL CONDUCTIVITY; THERMOMETERS;

HEAT FLUX;

EID: 77955298845     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.4000469     Document Type: Article

References (20)

1. Vityaz, P.A., Konev, S.K., Medvedev, V.B., and Sheleg, V.K., 1984, "Heat Pipes With Bidispersed Capillary Structures," Proceedings of the Fifth International Heat Pipe Conference, Vol. 1, pp. 127-135.
2. North, M.T., Rosenfeld, J.H., and Shaubach, R.M., 1995, "Liquid Film Evaporation From Bi-Dispersed Capillary Wicks in Heat Pipe Evaporators," Proceedings of the Ninth International Heat Pipe Conference, Albuquerque, NM, May 1-5, pp. 143-147.
3. North, M.T., Sarraf, D.B., Rosenfeld, J.H., Maidanik, Y.F., and Vershinin, S., 1997, "High Heat Flux Loop Heat Pipes," AIP Conf. Proc., 387, pp. 561-566.
4. Wang, J., and Catton, I., 2004, "Vaporization Heat Transfer in Biporous Wicks of Heat Pipe Evaporators," Proceedings of the 13th International Heat Pipe Conference, Vol. 2, pp. 76-86.
5. Cao, X.L., Cheng, P., and Zhao, T.S., 2002, "Experimental Study of Evaporative Heat Transfer in Sintered Copper Bidispersed Wick Structures," J. Thermophys. Heat Transfer, 16(4), pp. 547-552.
6. Merilo, E.G., Semenic, T., and Catton, I., 2004, "Experimental Investigation of Boiling Heat Transfer in Bidispersed Media," Proceedings of the 13th International Heat Pipe Conference, Vol. 2, pp. 87-93.
7. Li, C., Peterson, G.P., and Wang, Y., 2006, "Evaporation/Boiling on Thin Capillary Wick (I): Thickness Effects," ASME J. Heat Transfer, 128, pp. 1312-1319.
8. Semenic, T., Lin, Y., and Catton, I., 2005, "Biporous Sintered Copper for a Closed Loop Heat Pipe Evaporator," ASME Paper No. IMECE2005-82180.
9. Reilly, S.W., and Catton, I., 2009, "Improving Biporous Heat Transfer by Addition of Monoporous Interface Layer," ASME Paper No. HT2009-88257.
10. Dresselhaus, M.S., Dresselhaus, G., and Avouris, P., eds., 2001, Carbon Nanotubes Synthesis, Structure, Properties and Applications, Springer, Berlin.
11. Kim, P., Shi, L., Majumdar A., and McEuen, P.L., 2001, "Thermal Transport Measurement of Individual Multiwalled Nanotubes," Phys. Rev. Lett., 87, p. 215502.
12. Cai, Q., Chen, C.L., Xiong, G., and Ren, Z.F., 2008, "Exploration of Carbon Nanotube Wick Structure for High Heat Flux Cooling," ASME Paper No. HT2008-56208.
13. Jiang, L., Wong, M., and Zohar, Y., 1999, "A Micro-Channel Heat Sink With Integrated Temperature Sensors for Phase Transition Study," 12th IEEE International Conference on Micro ElectroMechanical Systems, Jan. 17-21, pp. 159-164.
14. Datta, J.R., 1995, "Heater Integrated Sensor System," Proceedings of the IEEE International Symposium on Industrial Electronics, Jul. 10-14, pp. 849-854.
15. Tait, R.B., Huphries, R., and Lorenz, J., 1994, "Thick Film Heater Elements and Temperature Sensors in Modern Domestic Appliances," IEEE Trans. Ind. Appl., 30(3), pp. 573-577.
16. Chen, H.T., Liu, C.W., Liu, S.G., Yang, C.S., and Gau, C., 2007, "Fabrication of a Complicated Heat Transfer Microchannel System for CPU Cooling Study," Proceedings of the Second IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Jan. 16-19, pp. 654-658.
17. Nicholas, J.V., and White, D.R., 2001, Traceable Temperature, 2nd ed., Wiley, New York.
18. Cai, Q., Chen, B.C., Zhao, Y., Mack, J., Ma, Y., Chen, C.L., Wang, H., and Ren, Z.F., 2009, "Thermal Property Measurements of Carbon Nanotube Forest Synthesized by Thermal CVD Process," ASME Paper No. HT2009-88076.
19. Faghri, A., 1995, Heat Pipe Science and Technology, Taylor & Francis, New York.
20. Wang, H., Garimella, S.V., and Murthy, J.Y., 2007, "Characteristics of an Evaporating Thin Film in a Microchannel," Int. J. Heat Mass Transfer, 50, pp. 3933-3942.