-
1
-
-
0029271533
-
Liquid Cooling Performance for 3-D Multichip Module and Miniature Heat Sink
-
Vogel, M. R., 1995, "Liquid Cooling Performance for 3-D Multichip Module and Miniature Heat Sink," IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 18(1), pp. 68-73.
-
(1995)
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
, vol.18
, Issue.1
, pp. 68-73
-
-
Vogel, M.R.1
-
2
-
-
0242573452
-
Experimental Study on Silicon Micro-Heat Pipe Arrays
-
Launay, A., 2004, "Experimental Study on Silicon Micro-Heat Pipe Arrays," Appl. Therm. Eng., 24(2-3), pp. 233-243.
-
(2004)
Appl. Therm. Eng.
, vol.24
, Issue.2-3
, pp. 233-243
-
-
Launay, A.1
-
3
-
-
0242573522
-
Cooling of Mobile Electronic Devices Using Phase Change Materials
-
Tan, F. L., 2004, "Cooling of Mobile Electronic Devices Using Phase Change Materials," Appl. Therm. Eng., 24(2-3), pp. 159-169.
-
(2004)
Appl. Therm. Eng.
, vol.24
, Issue.2-3
, pp. 159-169
-
-
Tan, F.L.1
-
4
-
-
77955224827
-
-
WO2007057871
-
Walsh, E. J., Grimes, R., and Punch, J., 2007, "A Cooling Device," WO2007057871.
-
(2007)
A Cooling Device
-
-
Walsh, E.J.1
Grimes, R.2
Punch, J.3
-
5
-
-
28844453609
-
Effect of Geometric Scaling on Aerodynamic Performance
-
Grimes, R., Walsh, E. J., Quin, D., and Davies, M. R. D., 2005, "Effect of Geometric Scaling on Aerodynamic Performance," AIAA J., 43(11), pp. 2293-2298.
-
(2005)
AIAA J
, vol.43
, Issue.11
, pp. 2293-2298
-
-
Grimes, R.1
Walsh, E.J.2
Quin, D.3
Davies, M.R.D.4
-
6
-
-
52949091100
-
Profile Scaling of Miniature Centrifugal Fans
-
Walsh, P., Egan, V., Grimes, R., and Walsh, E., 2009, "Profile Scaling of Miniature Centrifugal Fans," Heat Transfer Eng., 30(1-2), pp. 130-137.
-
(2009)
Heat Transfer Eng
, vol.30
, Issue.1-2
, pp. 130-137
-
-
Walsh, P.1
Egan, V.2
Grimes, R.3
Walsh, E.4
-
7
-
-
72149094575
-
Acoustic Emissions From Active Cooling Solutions for Portable Devices
-
in press
-
Walsh, E. J., Walsh, P. A., Punch, J., and Grimes, R., "Acoustic Emissions From Active Cooling Solutions for Portable Devices," IEEE Trans. Compon. Packag. Technol., in press.
-
IEEE Trans. Compon. Packag. Technol.
-
-
Walsh, E.J.1
Walsh, P.A.2
Punch, J.3
Grimes, R.4
-
8
-
-
77955254536
-
-
ASME Paper No. FEDSM2003-45686
-
Day, S. W., Lemire, P. P., Flack, R. D., and McDaniel, J. C., 2003, "Effect of Reynolds Number on Performance of a Small Centrifugal Pump," ASME Paper No. FEDSM2003-45686.
-
(2003)
Effect of Reynolds Number on Performance of a Small Centrifugal Pump
-
-
Day, S.W.1
Lemire, P.P.2
Flack, R.D.3
McDaniel, J.C.4
-
10
-
-
0036767708
-
Heat Transfer From Square Pin-Fin Heat Sinks Using Air Impingement Cooling
-
Maveety, J. G., and Jung, H. H., 2002, "Heat Transfer From Square Pin-Fin Heat Sinks Using Air Impingement Cooling," IEEE Trans. Compon. Packag. Technol., 25(3), pp. 459-469.
-
(2002)
IEEE Trans. Compon. Packag. Technol.
, vol.25
, Issue.3
, pp. 459-469
-
-
Maveety, J.G.1
Jung, H.H.2
-
11
-
-
68949190979
-
Thermal Management of Low Profile Electronic Equipment Using Radial Fans and Heat Sinks
-
Walsh, E. J., Walsh, P., Grimes, R., and Egan, V., 2008, "Thermal Management of Low Profile Electronic Equipment Using Radial Fans and Heat Sinks," ASME J. Heat Transfer, 130(12), p. 125001.
-
(2008)
ASME J. Heat Transfer
, vol.130
, Issue.12
-
-
Walsh, E.J.1
Walsh, P.2
Grimes, R.3
Egan, V.4
-
12
-
-
34548827596
-
Low Profile Fan and Heat Sink Thermal Management Solution for Portable Electronics Applications
-
Walsh, E. J., and Grimes, R., 2007, "Low Profile Fan and Heat Sink Thermal Management Solution for Portable Electronics Applications," Int. J. Therm. Sci., 46, pp. 1182-1190.
-
(2007)
Int. J. Therm. Sci.
, vol.46
, pp. 1182-1190
-
-
Walsh, E.J.1
Grimes, R.2
-
13
-
-
77955245353
-
Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins
-
Packag., accepted
-
Egan, V., Walsh, P. A., Walsh, E., and Grimes, R., "Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins," ASME J. Electron. Packag., accepted.
-
(1989)
ASME J. Electron.
-
-
Egan, V.1
Walsh, P.A.2
Walsh, E.3
Grimes, R.4
-
17
-
-
0003397084
-
-
9th ed., McGraw-Hill, New York
-
Holman, J. P., 2002, Heat Transfer, 9th ed., McGraw-Hill, New York.
-
(2002)
Heat Transfer
-
-
Holman, J.P.1
-
18
-
-
37249076895
-
On the Characterisation of Finned and Finless Heat Sinks for Portable Electronics
-
Puebla, Mexico, Jun. 18-20
-
Egan, V., Walsh, P., Walsh, E., and Grimes, R., 2007, "On the Characterisation of Finned and Finless Heat Sinks for Portable Electronics," Fifth International Conference on Nanochannels, Microchannels and Minichannels, Puebla, Mexico, Jun. 18-20.
-
(2007)
Fifth International Conference on Nanochannels, Microchannels and Minichannels
-
-
Egan, V.1
Walsh, P.2
Walsh, E.3
Grimes, R.4
-
19
-
-
0002477246
-
Describing Uncertainties in Single-Sample Experiments
-
Kline S. J., and McClintock F. A., 1953, "Describing Uncertainties in Single-Sample Experiments," Mech. Eng. (Am. Soc. Mech. Eng.), 75, pp. 3-8.
-
(1953)
Mech. Eng. (Am. Soc. Mech. Eng.)
, vol.75
, pp. 3-8
-
-
Kline, S.J.1
McClintock, F.A.2
-
20
-
-
0002128489
-
Closed-Form Equation for Thermal Constriction/Spreading Resistances With Variable Resistances Boundary Conditions
-
Song, S., Lee, S., and Au, V., 1994, "Closed-Form Equation for Thermal Constriction/Spreading Resistances With Variable Resistances Boundary Conditions," IEPS Conference.
-
(1994)
IEPS Conference
-
-
Song, S.1
Lee, S.2
Au, V.3
|