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Volumn 49, Issue 1, 2010, Pages 25-34

Simulation of discontinuous dynamic recrystallization in pure Cu using a probabilistic cellular automaton

Author keywords

Cellular automaton; Copper; Hot compression; Recrystallization

Indexed keywords

BOUNDARY ENERGIES; COMPETING PROCESS; DISCONTINUOUS DYNAMIC RECRYSTALLIZATION; DISCONTINUOUS RECRYSTALLIZATION; FLOW STRESS; GRAIN SHAPES; GRAIN SIZE; HOT COMPRESSION; INITIAL GRAIN SIZE; MACROSCOPIC DEFORMATIONS; MACROSCOPIC FLOW STRESS; MICROSTRUCTURAL CHANGES; MULTIPLE-PEAK; POST PROCESSING; PROBABILISTIC CELLULAR AUTOMATONS; RECRYSTALLIZATION; RECRYSTALLIZATION KINETICS; RECRYSTALLIZATIONS; RECRYSTALLIZED GRAINS; SERRATED FLOW; STORED ENERGY; STRAIN STATE; THERMAL CONDITION;

EID: 77955281667     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2010.04.012     Document Type: Article
Times cited : (122)

References (51)
  • 43
    • 0019634371 scopus 로고
    • Kinetics of flow and strain hardening
    • H. Mecking, and U.F. Kocks Kinetics of flow and strain hardening Acta Metallurgica 29 1981 1865 1875
    • (1981) Acta Metallurgica , vol.29 , pp. 1865-1875
    • Mecking, H.1    Kocks, U.F.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.