Nanostructurally small cracks (NSC): A review on atomistic modeling of fatigue

International Journal of Fatigue

Volumn 32, Issue 9, 2010, Pages 1473-1502

  Horstemeyer, M F ^a   Farkas, D ^b   Kim, S ^a   Tang, T ^a   Potirniche, G ^c  

^a MISSISSIPPI STATE UNIVERSITY   (United States)

^b State University   (United States)

^c UNIVERSITY OF IDAHO   (United States)

Author keywords

Atomistic modeling; Embedded atom method; Fatigue; Nanostructurally small crack; Structural nanomaterials

Indexed keywords

ATOMIC BONDS; ATOMIC LATTICE; ATOMIC SCALE; ATOMISTIC MODELING; ATOMISTIC SIMULATIONS; CONTINUUM MODELING; COPPER POLYCRYSTALS; CRACK ADVANCE; CRACK EXTENSION; CRACK PATHS; CRACK PLANE; CRACK-GROWTH MECHANISMS; CRYSTALLOGRAPHIC DIRECTIONS; CYCLIC LOADINGS; DAMAGING MECHANISM; DISLOCATION SUBSTRUCTURES; EMBEDDED-ATOM METHOD; EXPERIMENTAL STUDIES; FATIGUE BEHAVIOR; FATIGUE CRACK GROWTH; FATIGUE CRACKS; GRAIN BOUNDARY INTERFACE; HIGH DENSITY; HIGH DISLOCATION DENSITY; INFLUENCING FACTOR; LONG CRACKS; LOW TEMPERATURES; MACRO SCALE; MAIN CRACK; MICRON RANGE; MICROSTRUCTURALLY SMALL CRACKS; MIDDLE TENSIONS; MILLIMETER RANGE; MISORIENTATIONS; MIXED MODE; MODIFIED EMBEDDED ATOM METHODS; MOLECULAR STATICS; MONTE CARLO; MULTIPLE SLIPS; NANO SCALE; NANO-CRACKS; NANO-MATERIALS; NANO-SCALE MECHANISM; NANOSCALE SIZE; PARIS LAW EXPONENT; PERIODIC BOUNDARY CONDITIONS; PERSISTENT SLIP BANDS; PLASTIC SLIP; SIMULATION RESULT; SLIP BAND; SMALL CRACK; STRESS INTENSITY AMPLITUDE; STRUCTURAL COMPONENT;

ATOMS; BICRYSTALS; CONTINUUM MECHANICS; COPPER; CRACK PROPAGATION; CRACK TIPS; CRYSTAL ATOMIC STRUCTURE; CRYSTAL ORIENTATION; CYCLIC LOADS; DISLOCATIONS (CRYSTALS); DURABILITY; FATIGUE DAMAGE; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; GROWTH RATE; MOLECULAR DYNAMICS; MONTE CARLO METHODS; NANOSTRUCTURED MATERIALS; NICKEL; NICKEL ALLOYS; NUCLEATION; PLASTICS; POLYCRYSTALS; WELDS;

SINGLE CRYSTALS;

EID: 77955215316     PISSN: 01421123     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijfatigue.2010.01.006     Document Type: Article

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