Polysiloxane based flexible electrical-optical-circuits-board

Microelectronic Engineering

Volumn 87, Issue 11, 2010, Pages 2268-2274

  Cai, D K ^a   Neyer, A ^a  

^a TU DORTMUND UNIVERSITY   (Germany)

Author keywords

Electrical optical circuits board; Packaging and environmental stability; Polysiloxane; Waveguide

Indexed keywords

BEFORE AND AFTER; BOARD PACKAGING; ENVIRONMENTAL STABILITY; ENVIRONMENTAL TEST; PACKAGING TECHNIQUES; POLYSILOXANE; POLYSILOXANES; THERMAL STABILITY; WAVEGUIDE LAYERS;

ENVIRONMENTAL TESTING; MECHANICAL PROPERTIES; OPTICAL PROPERTIES; PACKAGING; POLYIMIDES; SILICONES; WAVEGUIDES;

MECHANICAL STABILITY;

EID: 77954888310     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.02.014     Document Type: Article

References (9)

1. D.K. Cai, Optical and Mechanical Aspects on Polysiloxane Based Electrical-Optical-Circuits-Board, Ph.D. Thesis, Dortmund University of Technology, 2008.
2. A. Neyer, S. Kopetz, E. Rabe, et al., Electrical-optical circuit board using polysiloxane optical waveguide layer, in: Proceedings of 55th Electronic Components and Technology Conference, Orlando, FL, May, 2005, pp. 246-250.
3. S. Kopetz, D.K. Cai, and A. Neyer ÄEU-Int. J. Electron. Commun. 61 2007 163 167
4. L. Szetsen, T. Yu-Chung, and H. Chin-Fa J. Vac. Sci. Technol. B 18 2 2004 805 810
5. R. Oosterom, and T.J. Ahmed Med. Eng. Phys. 28 2005 323 330
6. H. Asai, and H.N. Iwase IEEE Tran. Adv. Packaging 24 1 2001 104 112
7. S. Park, and H. Lee J. Colloid Interf. Sci. 285 2005 267 272
8. D. Owens, and R. Wendt J. Appl. Polym. Sci. 13 1963 1741 1747
9. S.J. Luo, M. Vidal, C.P. Wong, Study on surface tension and adhesion in electronic packaging, in: Proceedings of 50th Electronic Components and Technology Conference, Las Vegas, NV, May, 2000, pp. 586-591.