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Volumn 1, Issue , 2005, Pages 246-250

Electrical-optical circuit board using polysiloxane optical waveguide layer

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL-OPTICAL CIRCUIT BOARDS; OE-MODULES; OPTICAL LAYERS;

EID: 24644459473     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (44)

References (18)
  • 1
    • 24644517999 scopus 로고
    • Optical interconnections for digital systems
    • IEEE, Sept.
    • D.Z.Tsang/'Optical interconnections for digital systems", Aerospace and Electronic Systems Magazine, IEEE,vol.7, Sept.1992, pp.10-15.
    • (1992) Aerospace and Electronic Systems Magazine , vol.7 , pp. 10-15
    • Tsang, D.Z.1
  • 3
    • 24644475730 scopus 로고    scopus 로고
    • Optical backplanes for avionic and telecommunication
    • Oldenbourg Verlag
    • J.Moisel, "Optical Backplanes for Avionic and Telecommunication", Information Technology, vol 45,Oldenbourg Verlag, 2003, pp.72-78.
    • (2003) Information Technology , vol.45 , pp. 72-78
    • Moisel, J.1
  • 5
    • 84861251327 scopus 로고    scopus 로고
    • www.zenphotonics.com
  • 6
    • 84861251328 scopus 로고    scopus 로고
    • www.davidlu.net
  • 9
    • 84861251329 scopus 로고    scopus 로고
    • www.luvantix.com
  • 10
    • 0037953137 scopus 로고    scopus 로고
    • Simple and low cost fabrication of thermally stable polymeric multimode waveguides using UV-curable epoxy
    • J.Kim, J.Kang and J.J.Kim, "Simple and low cost fabrication of thermally stable polymeric multimode waveguides using UV-curable epoxy", Jpn. J. Appl. Phys., vol.42, 2003, pp. 1277-1279.
    • (2003) Jpn. J. Appl. Phys. , vol.42 , pp. 1277-1279
    • Kim, J.1    Kang, J.2    Kim, J.J.3
  • 11
    • 0141951976 scopus 로고    scopus 로고
    • SMT-compatible large-tolerance "optobump" interface for interchip optical interconnections
    • Y.Ishii,S.Koike,Y.Arai and Y.Ando, "SMT-compatible large-tolerance "optobump" interface for interchip optical interconnections", IEEE transactions on advanced packaging, vol.26, 2003, pp. 122-127.
    • (2003) IEEE Transactions on Advanced Packaging , vol.26 , pp. 122-127
    • Ishii, Y.1    Koike, S.2    Arai, Y.3    Ando, Y.4
  • 12
    • 0033715538 scopus 로고    scopus 로고
    • Integration of polymer optical waveguides into printed circuit boards
    • S. Lehmacher and A.Neyer, "Integration of polymer optical waveguides into printed circuit boards", Electron. Lett., vol. 36, 2000, pp. 1052-1053
    • (2000) Electron. Lett. , vol.36 , pp. 1052-1053
    • Lehmacher, S.1    Neyer, A.2
  • 13
    • 0032640816 scopus 로고    scopus 로고
    • Optical interconnects by hot embossing for module and PCB technology - The EOCB approach
    • San Diego, USA, June
    • D. Krabe, W. Scheel, "Optical interconnects by hot embossing for module and PCB technology - The EOCB approach," Proceedings of 49th Electronics Components & Technology Conference, San Diego, USA, June 1999, pp. 1164-1166
    • (1999) Proceedings of 49th Electronics Components & Technology Conference , pp. 1164-1166
    • Krabe, D.1    Scheel, W.2
  • 15
    • 24644508873 scopus 로고    scopus 로고
    • US Patent Application: Polymer waveguides and process for producing the same, Pub. No.: US 2002/0150368 A1
    • US Patent Application: Polymer waveguides and process for producing the same, Pub. No.: US 2002/0150368 A1, 2002
    • (2002)
  • 17
  • 18
    • 84861239013 scopus 로고    scopus 로고
    • www.prospeos.de


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.