Optimization of heat pipe wick structures for low wattage electronics cooling applications

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Gupta, Anurag ^a   Upadhya, Girish ^b  

^a Johnson Matthey Electronics   (United States)

^b APPLE INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HEAT PIPES; LAPTOP COMPUTERS; OPTIMIZATION; POWDER METALS; SINTERING;

WIRE SCREEN WICKS;

ELECTRONICS PACKAGING;

EID: 0343602905     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Faghri, A., 1995, "Heat Pipe Science and Technology" Taylor & Francis, Washington, DC, pp. 24-33, 221-266.
2. Gupta, A., and Upadhya, G., 1999, "A Model for Thermal Transport in Heat Pipes with Wrapped Wire Screen Wick," Proceedings of the International Systems Packaging Symposium 99, San Diego, pp. 319-324.
3. Kraus, A.D., and Bar-Cohen, A., 1983, "Thermal Analysis and Control of Electronic Equipment," Hemisphere Publishing Corporation, NY, pp. 409- 434.
4. Peterson, G.P., 1994, "An Introduction to Heat Pipes Modeling, Testing and Applications," John Wiley and sons.