Investigation of curing behaviour of melamine/phenolic (MP) thermosets

Polymer Testing

Volumn 29, Issue 6, 2010, Pages 723-728

  Stark, W ^a  

^a BAM FEDERAL INSTITUTE FOR MATERIALS RESEARCH AND TESTING   (Germany)

Author keywords

Cross linking; DSC; Melamine; Moulding compound; Phenol; Thermoset

Indexed keywords

DIELECTRIC ANALYSIS; DIELECTRIC METHODS; DSC; ON-LINE MEASUREMENT; ON-LINE PROCESS MONITORING; THERMAL ANALYSIS; ULTRASOUND METHODS; ULTRASOUND SENSORS;

DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; MELAMINE FORMALDEHYDE RESINS; MOLDING; ONLINE SYSTEMS; PHENOLS; PROCESS MONITORING; THERMOANALYSIS; ULTRASONICS;

CONDENSATION REACTIONS;

EID: 77954495661     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2010.05.008     Document Type: Article

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