Enhancement of thermal stability of filled skutterudite thermoelectric materials through Nano-SiO2 coating

Wuji Cailiao Xuebao/Journal of Inorganic Materials

Volumn 25, Issue 6, 2010, Pages 577-582

  Wei, Ping ^a   Dong, Chun Lei ^a   Zhao, Wen Yu ^a   Zhang, Qing Jie ^a  

^a WUHAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Filled skutterudite; SiO2 coating; Thermal stability; Thermoelectric material

Indexed keywords

BULK MATERIALS; CHEMICAL COMPOSITIONS; FILLED SKUTTERUDITE; NANO- SIO; NANOCOMPOSITE MATERIALS; QUENCHING TIME; SPARK PLASMA SINTERING METHOD; THERMAL STABILITY; THERMOELECTRIC MATERIAL; THERMOELECTRIC PROPERTIES; WET CHEMICALS;

BARIUM; CHEMICAL STABILITY; COATINGS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MATERIALS HANDLING EQUIPMENT; MICROSTRUCTURAL EVOLUTION; NANOCOMPOSITES; QUENCHING; SPARK PLASMA SINTERING; THERMAL CYCLING; THERMODYNAMIC STABILITY; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY;

SILICON COMPOUNDS;

EID: 77954288216     PISSN: 1000324X     EISSN: None     Source Type: Journal    
DOI: 10.3724/SP.J.1077.2010.00577     Document Type: Article

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