Analysis and design of the IBM power 575 supercomputing node cold plate assembly

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 2, Issue , 2010, Pages 897-905

  Campbell, Levi A ^a   Ellsworth Jr , Michael J ^a   Sinha, Arvind K ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYSIS AND DESIGN; CFD MODELING; COLD PLATES; COMPUTATIONAL FLUID DYNAMICS MODELING; COPPER TUBING; DUAL CORE PROCESSORS; FINITE ELEMENT ANALYSIS; FLOW BALANCING; FORM FACTORS; LAND GRID ARRAYS; PROCESSOR MODULES; SYSTEM LEVELS; WATER COOLING;

APPROXIMATION THEORY; NANOTECHNOLOGY; TUBING;

COMPUTATIONAL FLUID DYNAMICS;

EID: 77953948148     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89244     Document Type: Conference Paper

References (4)

1. IBM Power Systems Announce Overview, April 8, 2008, http://www-03. ibm.com/systems/resources/systems-ower-ews-nno uncement-0080408-nnc.pdf
2. Ellsworth, Jr., M.J., Campbell, L.A., Simons, R.E., Iyengar, M.K., Schmidt, R.R., Chu, R.C., "The Evolution of Water Cooling for IBM Large Server Systems: Back to the Future," proceedings of the 2008 ITherm Conference, Orlando, FL, USA, May 28-31.
3. FLUENT software manufactured by ANSYS, Inc., Southpointe, 275 Technology Drive, Canonsburg, PA 15317, http://vvww.fluent.com/.
4. ANSYS 11.0 software manufactured by ANSYS, Inc., Southpointe, 275 Technology Drive, Canonsburg, PA 15317, http://www.ansys.com/default.asp.