Thermal imaging of two-phase cooled microgap channel wall

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 2, Issue , 2010, Pages 491-499

  Sheehan, Jessica ^a   Kim, Dae Whan ^b   Bar Cohen, Avram ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b Samsung Electronics DM R and D Center   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNULAR FLOWS; CHANNEL WALL; COOLING CAPABILITY; DIRECT CONTACT; DRY-OUT; ELECTRONIC COMPONENT; FORCED FLOWS; HEATED SURFACES; HIGH HEAT FLUX; HIGH QUALITY; IR IMAGES; MASS FLUX; MICRO GAPS; NARROW CHANNEL; PHASE CHANGE; SAPPHIRE WINDOWS; TEMPERATURE VARIATION; THERMAL IMAGING; THERMAL MANAGEMENT; THERMAL TRANSPORT; TWO PHASE MIXTURES; UPPER BOUND;

HEAT FLUX; INFRARED IMAGING; MULTIPHASE FLOW; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; TEMPERATURE DISTRIBUTION;

DIELECTRIC LIQUIDS;

EID: 77953922873     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89238     Document Type: Conference Paper

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