Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Volumn , Issue , 2010, Pages

  Wiese, Steffen ^a   Meier, Rico ^a   Kraemer, Frank ^a  

^a FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENTS OF THERMAL EXPANSIONS; COPPER MATERIALS; CRITICAL STEPS; FATIGUE BEHAVIOUR; HEAT-UP; INTERCONNECTORS; MECHANICAL BEHAVIOUR; MECHANICAL STRESS; MECHANICAL TESTS; PHOTOVOLTAIC MODULES; SILICON CELLS; SOLAR MODULE; SUBSEQUENT COOLING; TEMPERATURE FLUCTUATION; TEMPERATURE-INDUCED; THERMO-MECHANICAL STRESS;

COPPER; ENERGY CONVERSION; FATIGUE OF MATERIALS; MECHANICAL ENGINEERING; MICROELECTRONICS; MICROSYSTEMS; SOLAR CELLS; SOLAR POWER GENERATION; SOLDERING; THERMAL EXPANSION;

STRESSES;

EID: 77953695724     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2010.5464551     Document Type: Conference Paper

References (2)

1. Wiese, S. et al, "Constitutive Behaviour of Copper Ribbons used in Solar Cell Assembly Processes", Proceedings 10th EuroSimE Conference 2009, 28- 30 April 2009, Delft, pp. 44-51.
2. A. M. Gabor et al, "Soldering induced damage to thin Si solar cells and detection of cracked cells in modules", Proceedings of the 21st European Photovoltaic Solar Energy Conference, and Exhibition 2007: Dresden, Germany, September 04.-08.09.2006