Design and analysis of an in-plane thermoelectric microcooler

Nanoscale and Microscale Thermophysical Engineering

Volumn 14, Issue 2, 2010, Pages 95-109

  Yao, Da Jeng ^a   Chen, Gang ^b   Kim, Chang Jin ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b Massachusetts Institute of Technology   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Contact resistance; In plane; Microcooler; Thermoelectric

Indexed keywords

BULK DEVICES; CLASSICAL SIZE EFFECT; DESIGN AND ANALYSIS; ELECTRON TRANSPORT; ELECTRONS AND PHONONS; FILM PLANES; IN-PLANE; MICROCOOLER; MICROCOOLERS; MODELING RESULTS; THERMOELECTRIC DEVICES; THERMOELECTRIC MICROCOOLERS;

CONTACT RESISTANCE; DESIGN; FLEXIBLE STRUCTURES;

THERMOELECTRIC EQUIPMENT;

EID: 77953530661     PISSN: 15567265     EISSN: None     Source Type: Journal    
DOI: 10.1080/15567265.2010.484008     Document Type: Article

References (21)

1. R.C. Chu, and R.E. Simons, Application of Thermoelectrics to Cooling Electronics: Review and Prospects, 18th International Conference on Thermoelectrics, August 29-September 2, Baltimore, MD, 1999, pp. 270-279.
2. I. Yamasaki, and R. Yamanaka, Thermoelectric Properties of Bi2Te3/Sb2Te3 Superlattice Structure, 17th International Conference on Thermoelectrics, May 24-28, Nagoya, Japan, 1999, pp. 210-213.
3. A. Sipatov, and V. Volobuev, Thermoelectric Characteristics of PhS/EuS Superlattices, 18th International Conference on Thermoelectrics, August 29-September 2, Baltimore, MD, 1999, pp. 198-200.
4. G.S., Nolas, G.A. Slack, J.L. Cohn, and S.B. Schujman, The Next Generation of Thermoelectric Materials, 17th International Conference on Thermoelectrics, May 24-28, Nagoyo, Japan, 1998, pp. 294-296.
5. G.D. Mahan, and J.O. Sofo, The Best Thermoelectric, Proceedings of the National Academy of Sciences of the United States, Vol.93, No.15, pp. 7436-7439, 1996.
6. L.D. Hicks, and M.S. Dresselhaus, Effect of Quantum-Well Structures on the Thermoelectric Figure of Merit, Physical Review B - Condensed Matter, Vol.47, No.19, pp. 12727-12731, 1993.
7. D.J. Bergman, and L.G. Fel, Enhancement of Thermoelectric Power Factor in Composite Thermoelectrics, Journal of Applied Physics, Vol.85, No.12, pp. 8205-8216, 1999.
8. M.S. Dresselhaus, et al., Thermoelectricity in Bi Nanowires, American Physical Society, 1998.
9. D.-J. Yao, G. Chen, and C.-J. Kim, Spot Cooling Using Thermoelectric Microcoolers, 17th International Conference on Thermoelectrics, August 29-September, Baltimore, MD, 1999, pp. 256-259.
10. G. Min, D.M. Rowe, and F. Volklein, Integrated Thin Film Thermoelectric Cooler. Electronics Letters, Vol.34, No.2, pp. 222-223, 1998.
11. A. Balandin, and K.L. Wang, Effect of Phonon Confinement on the Thermoelectric Figure of Merit of Quantum Wells, Journal of Applied Physics, Vol.84, No.11, pp. 6149-6153, 1998.
12. A. Boyer, E. Cisse, and Y. Azzouz, Medium-Power Thermophiles Using Thin-Film Technology, Sensors and Actuators A - Physical, Vol.24, No.3, pp. 217-220, 1990.
13. A. Boyer, and E. Cisse, Properties of Thin Film Thermoelectric Materials-Application to Sensors Using the Seebeck Effect, Materials Science and Engineering B -Solid State Materials for Advanced Technology, Vol.13 No.2, pp. 103-111, 1992.
14. D.K.Nayak, J.S. Park, J.C.S.Woo,K.L.Wang, and I.C. Ivanov, Interface Properties of Thin Oxides Grown on Strained Ge, Journal of Applied Physics, Vol.76, No.2, pp. 982-986, 1994.
15. D.K. Nayak, J.C.S. Woo, J.S. Park, K.L. Wang, and I.C.K.P. MacWilliams, Hole Confinement in a Si/GeSi/Si Quantum Well on SIMOX, IEEE Transactions on Electronic Devices, Vol.43, No.1, pp. 180-186, 1996.
16. J.-P. Fleurial, A. Borshchevsky, M.A. Ryan, W. Philips, E. Kolawa, T. Kacisch, and R. Ewell, Thermoelectric Microcoolers for Thermal Management Applications, 16th International Conference on Thermoelectrics, August 26-29, Dresden, Germany, 1997, pp. 641-645.
17. H.J. Goldsmid, Section V: Thermoelectric system and application, Chapter 59: Thermoelectric Refrigeration for Mass-Market Applications, pp. 59-61,59-8, Thermoelectric Refrigeration, in (eds.) D.K. Mendelssohn and D.K.D. Timmerhaus, Plenum Press, 1964.
18. R.Hull, and J.C. Bean, Germanium Silicon: Physics andMaterials, inR.K.Willardson and E. R. Weber (eds.), Semiconductors and Semimetals, Vol.56, pp. 825-856,Academic Press, 1999.
19. E. Kasper, Properties of Strained and Relaxed Silicon Germanium, Short Run Press, Exeter, UK, 1995.
20. S.P. Timoshenko, Theory of Plates and Shells, 2nd ed., McGraw-Hill, New York, 1959.
21. F.P. Incropera, and D.P.D. Witt, Fundamentals of Heat and Mass Transfer, John Wiley, New York, 1990.