Thermal analysis of a molded case circuit breaker -effect of electric contact resistance and bimetal design

23rd International Conference on Electrical Contacts, ICEC 2006 - together with the 6th International Session on Electromechanical Devices, IS-EMD 2006

Volumn , Issue , 2006, Pages 590-595

  Leung, Chi H ^a  

^a AMI DODUCO Inc   (United States)

Author keywords

Circuit breaker; Contact erosion; Finite difference thermal analysis; Silver tungsten; Thermostatic bimetal

Indexed keywords

ARC EROSION; CONTACT EROSION; CONTACT FORCES; CONTACT INTERFACE; HEAT GENERATING COMPONENTS; INPUT DATAS; MOLDED CASE CIRCUIT BREAKERS; TEMPERATURE RISE;

BIMETALS; ELECTRIC CIRCUIT BREAKERS; ELECTRIC CONTACTS; ELECTROMECHANICAL DEVICES; EROSION;

THERMOANALYSIS;

EID: 77953523082     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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