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Journal of the Electrochemical Society

Volumn 157, Issue 7, 2010, Pages

Effect of morphology and hydrogen evolution on porosity of electroplated cobalt hard gold

(4) Liu, Zhengwei a Zheng, Min b Hilty, Robert D b West, Alan C a

a Columbia University ^* (United States)

b Tyco Electronics (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSTANT CURRENT; CURRENT EFFICIENCY; CYANIDE BATHS; DENSITY OF PORES; ELECTROPLATED NI; FACETED SURFACES; FINER GRAINS; FOCUSED ION BEAM-SCANNING ELECTRON MICROSCOPIES; GOLD FILM; HARD GOLD; HIGH-PEAK CURRENTS; HYDROGEN EVOLUTION; HYDROGEN EVOLUTION RATE; HYDROGEN GENERATIONS; PLATING CONDITIONS; PLATING PARAMETERS; PORE DENSITIES; PULSE PLATING; PULSED CURRENTS; UNDERLAYERS;

COBALT; CYANIDES; ELECTROPLATING; GOLD; GOLD DEPOSITS; GRAIN BOUNDARIES; HYDROGEN PRODUCTION; MORPHOLOGY; POROSITY; SCANNING ELECTRON MICROSCOPY;

COBALT PLATING;

EID: 77953149059 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3430076 Document Type: Article

Times cited : (25)

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