Large strain deformation and cracking of nano-scale gold films on PDMS substrate

Materials Science and Engineering: B

Volumn 170, Issue 1-3, 2010, Pages 32-40

  Akogwu, Onobu ^a   Kwabi, David ^a   Midturi, Swaminadham ^a,b   Eleruja, Marcus ^a,c   Babatope, Babaniyi ^d   Soboyejo, W O ^a  

^a Princeton University   (United States)

^b UNIVERSITY OF ARKANSAS AT LITTLE ROCK   (United States)

^c OBAFEMI AWOLOWO UNIVERSITY   (Nigeria)

^d Engineering Materials Development Institute   (Nigeria)

Author keywords

Flexible electronics; Grain boundary cracking; Large strain deformation; Resistance changes; Tensile and cyclic damage

Indexed keywords

CRACKS; DEFORMATION; ELECTRONIC STRUCTURE; GOLD DEPOSITS; GRAIN BOUNDARIES; MICROCHANNELS; NANOTECHNOLOGY; SUBSTRATES; TENSILE STRAIN; THIN FILMS;

AU THIN FILMS; ELECTRON-BEAM; GOLD FILM; GRAIN BOUNDARY CRACKING; LARGE STRAIN DEFORMATION; LARGE STRAINS; NANO SCALE; POLYDIMETHYLSILOXANE(PDMS); RESISTANCE CHANGE; TENSILE AND CYCLIC DAMAGE;

FLEXIBLE ELECTRONICS;

EID: 77953139738     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2010.02.023     Document Type: Article

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