Chip-level spray cooling of an LD-MOSFET RF power amplifier+

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 411-416

  Cotler, A C ^a   Brown, E R ^a   Dhir, V ^a   Shaw, M C ^b  

^a University of California   (United States)

^b CALIFORNIA LUTHERAN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIPOLAR TRANSISTORS; COOLING; HEAT FLUX; HEAT RESISTANCE; MOSFET DEVICES; PERSONAL COMMUNICATION SYSTEMS; POWER AMPLIFIERS; RADIO FREQUENCY AMPLIFIERS; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACES;

CHIP LEVEL SPRAY COOLING; INTEGRATED GATE BIPOLAR TRANSISTORS; JUNCTION TEMPERATURE; LOW DELAY METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR; POWER ADDED EFFICIENCY; SOLID STATE POWER AMPLIFIER; WATER SPRAY COOLING;

ELECTRONICS PACKAGING;

EID: 3242784824     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828550     Document Type: Article

References (13)

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