3D integration of micro optical components on flexible transparent substrate with through-hole-vias

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 536-539

  Hsu, Hsiu Ting ^a   Su, Wang Shen ^b   Lee, Chih Chun ^a   Huang, Hsin Yu ^a   Lin, Hung Yi ^c   Fang, Weileun ^a,b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^c Touch Micro system Technology Inc   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ELECTROPLATING PROCESS; FLEXIBLE SUBSTRATE; FLEXIBLE TRANSPARENT SUBSTRATE; LED CHIPS; MICRO-LENS; MICRO-OPTICAL COMPONENTS; MOLDING PROCESS; PARYLENE COATINGS; ROUTINGS; SI SUBSTRATES; THROUGH HOLE; TRANSPARENT SUBSTRATE;

LIGHT EMITTING DIODES; LIGHTING; MECHANICAL ENGINEERING; MECHANICS; MICROOPTICS; MOLDING; POLYMERS; REACTIVE ION ETCHING; THREE DIMENSIONAL;

SUBSTRATES;

EID: 77952780600     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442446     Document Type: Conference Paper

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