A fully packaged piezoelectric switch with low-voltage actuation and electrostatic hold

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 212-215

  Cueff, Matthieu ^a   Defaÿ, Emmanuël ^a   Rey, Patrice ^a   Le Rhun, Gwenaël ^a   Perruchot, François ^a   Ferrandon, Christine ^a   Mercier, Denis ^a   Domingue, Frédéric ^a   Suhm, Aurélien ^a   Aïd, Marc ^a   Liu, Lianjiu ^b   Pacheco, Sergio ^b   Miller, Mel ^b  

^a CEA GRENOBLE   (France)

^b FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATION VOLTAGES; CONTACT FORCES; ELECTROSTATIC HOLD; EUTECTIC BONDING; GAP CONTROL; LOW-VOLTAGE; PIEZOELECTRIC ACTUATION; POST PROCESS; RF CHARACTERIZATION; RF-MEMS; WAFER-LEVEL PACKAGING TECHNOLOGY;

ELECTROSTATICS; MECHANICAL ENGINEERING; MECHANICS; REACTIVE ION ETCHING; SILICON WAFERS; WAFER BONDING;

PIEZOELECTRICITY;

EID: 77952762429     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442529     Document Type: Conference Paper

References (7)

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7. th, 2008, http://tel.archives-ouvertes.fr/tel-00373537/en/