Fluidic self-assembly of millimeter scale thin parts on preprogrammed substrate at air-water interface

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 504-507

  Park, Kwang Soon ^a   Xiong, Xugang ^a   Baskaran, Rajashree ^b   Böhringer, Karl F ^a  

^a University of Washington   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR WATER INTERFACES; DESIGN FACTORS; FLUIDIC SELF-ASSEMBLY; FUNCTIONALIZED; HIGH YIELD; NOVEL METHODS; SELF ALIGNMENT; SILICON CHIP; WAFER SUBSTRATES;

AIR; DESIGN OF EXPERIMENTS; MECHANICAL ENGINEERING; MECHANICS; REACTIVE ION ETCHING; SILICON WAFERS;

PHASE INTERFACES;

EID: 77952760858     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442454     Document Type: Conference Paper

References (6)

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