Hydrodynamic and thermal performance of a vapor-venting microchannel copper heat exchanger

Proceedings of the 6th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM2008

Volumn , Issue PART B, 2008, Pages 1363-1370

  David, Milnes P ^a   Marconnet, Amy ^a   Goodson, Kenneth E ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE PERFORMANCE; DRY-OUT; FIBER MEMBRANES; FIBER SUPPORT; HEAT EXCHANGER TECHNOLOGY; KEY ELEMENTS; LIQUID WATER; PTFE MEMBRANES; PUMPING POWER; SILICON MICROCHANNELS; THERMAL PERFORMANCE; THERMAL RESISTANCE; TWO-PHASE CONVECTION; VAPOR PHASE;

CARBON FIBERS; COOLING SYSTEMS; HEAT EXCHANGERS; MECHANICAL PROPERTIES; MEMBRANES; MICROCHANNELS; PHASE SEPARATION; PRESSURE DROP; SURFACE PROPERTIES; THERMOCOUPLES; WATER MANAGEMENT; WATER VAPOR;

HEAT RESISTANCE;

EID: 77952661665     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ICNMM2008-62269     Document Type: Conference Paper

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