Dielectric reliability of 50nm half pitch structures in aurora ® LK

Japanese Journal of Applied Physics

Volumn 48, Issue 4 PART 2, 2009, Pages

  Demuynck, Steven ^a   Kim, Honggun ^b   Huffman, Craig ^a   Darnon, Maxime ^a   Struyf, Herbert ^a   Versluijs, Janko ^a   Claes, Martine ^a   Vereecke, Guy ^a   Verdonck, Patrick ^a   Volders, Henny ^a   Heylen, Nancy ^a   Kellens, Kristof ^a   De Roest, David ^c   Sprey, Hessel ^c   Beyer, Gerald ^a  

^a IMEC   (Belgium)

^b SAMSUNG Electronics   (South Korea)

^c ASM BELGIUM   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CU ELECTROPLATING; DIELECTRIC RELIABILITY; DOUBLE PATTERNING; ELECTRICAL FIELD; HARD MASKS; HIGH YIELD; LOCAL FIELD ENHANCEMENT; POST-ETCH RESIDUES; RELIABILITY PERFORMANCE; TEST STRUCTURE; TIME-DEPENDENT; WEAK POINTS;

CHEMICAL POLISHING; RELIABILITY; SILICON COMPOUNDS; TITANIUM NITRIDE;

CHEMICAL MECHANICAL POLISHING;

EID: 77952509112     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.48.04C018     Document Type: Article

References (4)

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