Effect of thiourea concentration on the electrochemical behavior of gold and copper electrodes in presence and absence of Cu(II) ions.

Journal of the Chilean Chemical Society

Volumn 54, Issue 4, 2009, Pages 439-444

  Gomez H ^a   Lizama, H ^a   Suarez C ^a   Valenzuela, A ^a  

^a PONTIFICIA UNIVERSIDAD CATÓLICA DE VALPARAÍSO   (Chile)

Author keywords

Copper; Crystal quartz microbalance; Electrodeposition; Formamidine disulfide; Thiourea

Indexed keywords

EID: 77952331313     PISSN: 07179324     EISSN: 07179707     Source Type: Journal    
DOI: 10.4067/S0717-97072009000400026     Document Type: Article

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